Re: [PATCH 02/13] Thermal: Move thermal_instance to thermal.h

[Zhang Rui <rui.zhang@intel.com>]

On 四, 2012-08-09 at 18:15 +0530, Durgadoss R wrote:
> This patch moves the thermal_instance structure
> to thermal.h so that thermal management files
> (other than thermal_sys.c) can also access it.
> 
> Signed-off-by: Durgadoss R <durgadoss.r@intel.com>
> ---
>  drivers/thermal/thermal_sys.c |   21 ---------------------
>  include/linux/thermal.h       |   23 +++++++++++++++++++++++
>  2 files changed, 23 insertions(+), 21 deletions(-)
> 
> diff --git a/drivers/thermal/thermal_sys.c b/drivers/thermal/thermal_sys.c
> index 5be8728..a0e20f9 100644
> --- a/drivers/thermal/thermal_sys.c
> +++ b/drivers/thermal/thermal_sys.c
> @@ -41,27 +41,6 @@ MODULE_AUTHOR("Zhang Rui");
>  MODULE_DESCRIPTION("Generic thermal management sysfs support");
>  MODULE_LICENSE("GPL");
>  
> -#define THERMAL_NO_TARGET -1UL
> -/*
> - * This structure is used to describe the behavior of
> - * a certain cooling device on a certain trip point
> - * in a certain thermal zone
> - */
> -struct thermal_instance {
> -	int id;
> -	char name[THERMAL_NAME_LENGTH];
> -	struct thermal_zone_device *tz;
> -	struct thermal_cooling_device *cdev;
> -	int trip;
> -	unsigned long upper;	/* Highest cooling state for this trip point */
> -	unsigned long lower;	/* Lowest cooling state for this trip point */
> -	unsigned long target;	/* expected cooling state */
> -	char attr_name[THERMAL_NAME_LENGTH];
> -	struct device_attribute attr;
> -	struct list_head tz_node; /* node in tz->thermal_instances */
> -	struct list_head cdev_node; /* node in cdev->thermal_instances */
> -};
> -
>  static DEFINE_IDR(thermal_tz_idr);
>  static DEFINE_IDR(thermal_cdev_idr);
>  static DEFINE_MUTEX(thermal_idr_lock);
> diff --git a/include/linux/thermal.h b/include/linux/thermal.h
> index 8611e3e..f25df23 100644
> --- a/include/linux/thermal.h
> +++ b/include/linux/thermal.h
> @@ -33,6 +33,9 @@
>  #define THERMAL_MAX_TRIPS	12
>  #define THERMAL_NAME_LENGTH	20
>  
> +/* Initial state of a cooling device during binding */
> +#define THERMAL_NO_TARGET	-1UL
> +
>  /* No upper/lower limit requirement */
>  #define THERMAL_NO_LIMIT	-1UL
>  
> @@ -164,6 +167,26 @@ struct thermal_zone_device {
>  	struct delayed_work poll_queue;
>  };
>  
> +/*
> + * This structure is used to describe the behavior of
> + * a certain cooling device on a certain trip point
> + * in a certain thermal zone
> + */
> +struct thermal_instance {
> +	int id;
> +	char name[THERMAL_NAME_LENGTH];
> +	struct thermal_zone_device *tz;
> +	struct thermal_cooling_device *cdev;
> +	int trip;
> +	unsigned long upper;	/* Highest cooling state for this trip point */
> +	unsigned long lower;	/* Lowest cooling state for this trip point */
> +	unsigned long target;	/* expected cooling state */
> +	char attr_name[THERMAL_NAME_LENGTH];
> +	struct device_attribute attr;
> +	struct list_head tz_node; /* node in tz->thermal_instances */
> +	struct list_head cdev_node; /* node in cdev->thermal_instances */
> +};
> +

as this structure is used internally only, I'm thinking if we can rename
drivers/thermal/thermal_sys.c to drivers/thermal/thermal_core.c,
and introduce drivers/thermal/thermal_core.h for these internal stuff.
what do you think?

thanks,
rui
>  struct thermal_genl_event {
>  	u32 orig;
>  	enum events event;


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