From: Rob Herring <robh@kernel.org>
To: Bhupesh Sharma <bhupesh.sharma@linaro.org>
Cc: daniel.lezcano@linaro.org, linux-arm-msm@vger.kernel.org,
linux-pm@vger.kernel.org, andersson@kernel.org,
agross@kernel.org, bhupesh.linux@gmail.com, rafael@kernel.org,
devicetree@vger.kernel.org, linux-kernel@vger.kernel.org
Subject: Re: [PATCH 3/4] dt-bindings: thermal: Add qcom,qmi-tmd-device and qcom,tmd-device yaml bindings
Date: Mon, 12 Sep 2022 10:38:15 -0500 [thread overview]
Message-ID: <1662997095.474707.1345584.nullmailer@robh.at.kernel.org> (raw)
In-Reply-To: <20220912085049.3517140-4-bhupesh.sharma@linaro.org>
On Mon, 12 Sep 2022 14:20:48 +0530, Bhupesh Sharma wrote:
> Add qcom,qmi-tmd-device and qcom,tmd-device yaml bindings.
>
> Qualcomm QMI based TMD cooling device(s) are used for various
> mitigations for remote subsystem(s) including remote processor
> mitigation, rail voltage restriction etc.
>
> Each child node represents one remote subsystem and each child
> of this subsystem in-turn represents separate TMD cooling device.
>
> Cc: daniel.lezcano@linaro.org
> Cc: rafael@kernel.org
> Cc: andersson@kernel.org
> Cc: robh@kernel.org
> Signed-off-by: Bhupesh Sharma <bhupesh.sharma@linaro.org>
> ---
> .../bindings/thermal/qcom,qmi-tmd-device.yaml | 78 +++++++++++
> .../bindings/thermal/qcom,tmd-device.yaml | 122 ++++++++++++++++++
> include/dt-bindings/thermal/qcom,tmd.h | 14 ++
> 3 files changed, 214 insertions(+)
> create mode 100644 Documentation/devicetree/bindings/thermal/qcom,qmi-tmd-device.yaml
> create mode 100644 Documentation/devicetree/bindings/thermal/qcom,tmd-device.yaml
> create mode 100644 include/dt-bindings/thermal/qcom,tmd.h
>
My bot found errors running 'make DT_CHECKER_FLAGS=-m dt_binding_check'
on your patch (DT_CHECKER_FLAGS is new in v5.13):
yamllint warnings/errors:
dtschema/dtc warnings/errors:
/builds/robherring/dt-review-ci/linux/Documentation/devicetree/bindings/remoteproc/qcom,adsp.example.dtb: adsp: 'qcom,instance-id' is a required property
From schema: /builds/robherring/dt-review-ci/linux/Documentation/devicetree/bindings/thermal/qcom,tmd-device.yaml
/builds/robherring/dt-review-ci/linux/Documentation/devicetree/bindings/remoteproc/qcom,adsp.example.dtb: adsp: 'clock-names', 'clocks', 'compatible', 'cx-supply', 'interrupt-names', 'interrupts-extended', 'memory-region', 'qcom,smem-state-names', 'qcom,smem-states', 'smd-edge' do not match any of the regexes: '^tmd-device[0-9]?$', 'pinctrl-[0-9]+'
From schema: /builds/robherring/dt-review-ci/linux/Documentation/devicetree/bindings/thermal/qcom,tmd-device.yaml
doc reference errors (make refcheckdocs):
See https://patchwork.ozlabs.org/patch/
This check can fail if there are any dependencies. The base for a patch
series is generally the most recent rc1.
If you already ran 'make dt_binding_check' and didn't see the above
error(s), then make sure 'yamllint' is installed and dt-schema is up to
date:
pip3 install dtschema --upgrade
Please check and re-submit.
next prev parent reply other threads:[~2022-09-12 15:38 UTC|newest]
Thread overview: 13+ messages / expand[flat|nested] mbox.gz Atom feed top
2022-09-12 8:50 [PATCH 0/4] thermal: Introduce Qualcomm Cooling Driver suppport Bhupesh Sharma
2022-09-12 8:50 ` [PATCH 1/4] thermal: qcom: qmi_cooling: Add skeletal qmi cooling driver Bhupesh Sharma
2022-09-12 21:23 ` Jeff Johnson
2022-09-13 15:39 ` Bjorn Andersson
2022-09-13 18:42 ` Bjorn Andersson
2022-09-12 8:50 ` [PATCH 2/4] thermal: qcom: Add Kconfig entry & compilation support for " Bhupesh Sharma
2022-09-13 18:53 ` Bjorn Andersson
2022-09-12 8:50 ` [PATCH 3/4] dt-bindings: thermal: Add qcom,qmi-tmd-device and qcom,tmd-device yaml bindings Bhupesh Sharma
2022-09-12 15:38 ` Rob Herring [this message]
2022-09-12 15:58 ` Rob Herring
2022-09-13 19:10 ` Bjorn Andersson
2022-10-28 16:58 ` Krzysztof Kozlowski
2022-09-12 8:50 ` [PATCH 4/4] MAINTAINERS: Add entry for Qualcomm Cooling Driver Bhupesh Sharma
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