From mboxrd@z Thu Jan 1 00:00:00 1970 Received: from vms173005pub.verizon.net ([206.46.173.5]) by linuxtogo.org with esmtp (Exim 4.72) (envelope-from ) id 1SVV40-00067h-7K for openembedded-devel@lists.openembedded.org; Fri, 18 May 2012 23:50:20 +0200 Received: from gandalf.denix.org ([unknown] [108.48.117.33]) by vms173005.mailsrvcs.net (Sun Java(tm) System Messaging Server 7u2-7.02 32bit (built Apr 16 2009)) with ESMTPA id <0M48006HGMUFH4U1@vms173005.mailsrvcs.net> for openembedded-devel@lists.openembedded.org; Fri, 18 May 2012 16:39:52 -0500 (CDT) Received: by gandalf.denix.org (Postfix, from userid 1000) id 64C86201AE; Fri, 18 May 2012 17:39:50 -0400 (EDT) Date: Fri, 18 May 2012 17:39:50 -0400 From: Denys Dmytriyenko To: openembedded-devel@lists.openembedded.org Message-id: <20120518213950.GA4208@denix.org> References: MIME-version: 1.0 In-reply-to: User-Agent: Mutt/1.5.20 (2009-06-14) Subject: Re: Introducing the HidaV layer X-BeenThere: openembedded-devel@lists.openembedded.org X-Mailman-Version: 2.1.11 Precedence: list Reply-To: openembedded-devel@lists.openembedded.org List-Id: Using the OpenEmbedded metadata to build Distributions List-Unsubscribe: , List-Archive: List-Post: List-Help: List-Subscribe: , X-List-Received-Date: Fri, 18 May 2012 21:50:23 -0000 Content-type: text/plain; charset=us-ascii Content-disposition: inline On Fri, May 18, 2012 at 10:09:42AM +0200, Thilo Fromm wrote: > Hello *.*, > > There's a new layer in town. HidaV will provide a common platform > layer, development support, and firmware for our yet-to-come ti8148 > based systems. The layer poses a symbiosis of a "board support" and a > "distribution" layer. HidaV integrates meta-ti, meta-openembedded, > meta-angstrom, and openembedded-core to a well-tailored distribution. > Although HidaV therefore heavily focuses on our own devices/boards we > hope to provide useful bug fixes and recipes for other projects/layers > as well. > > The code is here: > Some initial documentation: > > Finally, I would like to add HidaV to the openembedded layer index[1]. > Is there some formality involved in this, or do I just create a wiki > account and then edit it in? Just couple questions - wouldn't it be better to send fixes to the underlying layers that you integrate, instead of holding them in your own integration layer? And if it's for your unique ti8148-based board, then it's fine, it may warrant a separate BSP layer for that. But why did you chose to pre-integrate other layers into yours? Although you seem to be using sub-modules, but it's still pre-integration, a-la Yocto/Poky releases... Ah, and BTW, I think your layer ordering and priorities[1] are slightly wrong, as usually BSP layers reside lower than Software layers (i.e. meta-oe), but Distro layers (i.e. angstrom) should probably be on top... -- Denys