Re: linux-next: build warning after merge of the iio tree

[Jonathan Cameron <Jonathan.Cameron@Huawei.com>]

On Fri, 1 Jul 2022 18:28:49 +1000
Stephen Rothwell <sfr@canb.auug.org.au> wrote:

> Hi all,
> 
> On Fri, 1 Jul 2022 15:29:44 +1000 Stephen Rothwell <sfr@canb.auug.org.au> wrote:
> \> 
> > After merging the iio tree, today's linux-next build (x86_64 allmodconfig)
> > produced this warning:
> > 
> > WARNING: modpost: module qcom-spmi-adc-tm5 uses symbol qcom_adc_tm5_temp_volt_scale from namespace IIO_QCOM_VADC, but does not import it.
> > WARNING: modpost: module qcom-spmi-adc-tm5 uses symbol qcom_adc5_prescaling_from_dt from namespace IIO_QCOM_VADC, but does not import it.
> > WARNING: modpost: module qcom-spmi-adc-tm5 uses symbol qcom_adc5_hw_settle_time_from_dt from namespace IIO_QCOM_VADC, but does not import it.
> > WARNING: modpost: module qcom-spmi-adc-tm5 uses symbol qcom_adc5_avg_samples_from_dt from namespace IIO_QCOM_VADC, but does not import it.
> > WARNING: modpost: module qcom-spmi-adc-tm5 uses symbol qcom_adc5_decimation_from_dt from namespace IIO_QCOM_VADC, but does not import it.
> > 
> > Introduced by commit
> > 
> >   ec9b269f61cc ("iio: adc: qcom-vadc: Move symbol exports to IIO_QCOM_VADC namespace")  
> 
> This became a build failure in the arm64 defconfig build, so I have
> reverted that commit for today.
> 

As the original patch didn't have any thermal related parts / review, I've dropped
it for now rather than fixing up.  Will circle round with a new version in due time.

Thanks,

Jonathan