From: Huisong Li <lihuisong@huawei.com>
To: <dev@dpdk.org>, <andrew.rybchenko@oktetlabs.ru>
Cc: <ferruh.yigit@amd.com>, <humin29@huawei.com>, <3chas3@gmail.com>,
<liudongdong3@huawei.com>, <huangdaode@huawei.com>,
<lihuisong@huawei.com>
Subject: [PATCH 0/2] net/bonding: fix mbuf fast free for bond3 and bond4
Date: Tue, 8 Nov 2022 16:40:36 +0800 [thread overview]
Message-ID: <20221108084038.25136-1-lihuisong@huawei.com> (raw)
This patchset fixes mbuf fast free offload for bond3 and bond4.
Huisong Li (2):
net/bonding: fix bond3 and bond4 process mbuf fast free
app/testpmd: remove fast free offload for bond3 and bond4
app/test-pmd/testpmd.c | 8 ++++++++
drivers/net/bonding/rte_eth_bond_pmd.c | 6 ++----
2 files changed, 10 insertions(+), 4 deletions(-)
--
2.33.0
next reply other threads:[~2022-11-08 8:40 UTC|newest]
Thread overview: 8+ messages / expand[flat|nested] mbox.gz Atom feed top
2022-11-08 8:40 Huisong Li [this message]
2022-11-08 8:40 ` [PATCH 1/2] net/bonding: fix bond3 and bond4 process mbuf fast free Huisong Li
2022-11-08 8:40 ` [PATCH 2/2] app/testpmd: remove fast free offload for bond3 and bond4 Huisong Li
2022-11-08 18:01 ` Stephen Hemminger
2022-11-09 1:11 ` lihuisong (C)
2022-11-09 2:22 ` [PATCH V2] net/bonding: fix bond3 and bond4 process mbuf fast free Huisong Li
2022-11-09 3:24 ` Stephen Hemminger
2022-11-09 10:37 ` Andrew Rybchenko
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