From: Manivannan Sadhasivam <mani@kernel.org>
To: Caleb Connolly <caleb.connolly@linaro.org>
Cc: Andy Gross <agross@kernel.org>,
Bhupesh Sharma <bhupesh.linux@gmail.com>,
Bjorn Andersson <andersson@kernel.org>,
Konrad Dybcio <konrad.dybcio@linaro.org>,
Mathieu Poirier <mathieu.poirier@linaro.org>,
Rob Herring <robh+dt@kernel.org>,
Krzysztof Kozlowski <krzysztof.kozlowski+dt@linaro.org>,
Conor Dooley <conor+dt@kernel.org>,
"Rafael J. Wysocki" <rafael@kernel.org>,
Daniel Lezcano <daniel.lezcano@linaro.org>,
Amit Kucheria <amitk@kernel.org>, Zhang Rui <rui.zhang@intel.com>,
Sibi Sankar <quic_sibis@quicinc.com>,
Manivannan Sadhasivam <mani@kernel.org>,
Thara Gopinath <thara.gopinath@gmail.com>,
linux-arm-msm@vger.kernel.org, linux-remoteproc@vger.kernel.org,
devicetree@vger.kernel.org, linux-pm@vger.kernel.org
Subject: Re: [PATCH 0/4] thermal: Introduce Qualcomm Thermal Mitigation Device support
Date: Sun, 1 Oct 2023 21:27:01 +0530 [thread overview]
Message-ID: <20231001155701.GA53767@thinkpad> (raw)
In-Reply-To: <20230905-caleb-qmi_cooling-v1-0-5aa39d4164a7@linaro.org>
On Fri, Sep 29, 2023 at 05:16:16PM +0100, Caleb Connolly wrote:
> The Thermal Mitigation Device (TMD) Service is a QMI service that runs
> on remote subsystems (the modem and DSPs) on Qualcomm SoCs.
> It exposes various mitigations including passive thermal controls and
> rail voltage restrictions.
>
> This series introduces support for exposing TMDs as cooling devices
> in the kernel through the thermal framework, using the QMI interface.
>
> Each TMD client is described as a child of the remoteproc node in
> devicetree. With subnodes for each control.
>
Daniel expressed concerns in the past aganist representing TMD driver as a
cooling device since it is not tied to thermal zones and the governors cannot
use it. Instead he suggested to represent it as a powercap device with thermal
constraints.
So please look into that approach.
- Mani
> This series is based on previous work by Bhupesh Sharma which can be
> found at [1]. I'm sending this as a fresh series as it has been a
> year since the original version and I have rewritten most of the driver.
>
> [1]: https://lore.kernel.org/linux-arm-msm/20220912085049.3517140-1-bhupesh.sharma@linaro.org/
>
> ---
> Caleb Connolly (4):
> remoteproc: qcom: probe all child devices
> dt-bindings: thermal: Add qcom,qmi-cooling yaml bindings
> thermal: qcom: add qmi-cooling driver
> MAINTAINERS: Add entry for Qualcomm Cooling Driver
>
> .../bindings/remoteproc/qcom,msm8996-mss-pil.yaml | 13 +
> .../bindings/remoteproc/qcom,pas-common.yaml | 6 +
> .../bindings/thermal/qcom,qmi-cooling.yaml | 168 +++++++
> MAINTAINERS | 8 +
> drivers/remoteproc/qcom_q6v5.c | 4 +
> drivers/remoteproc/qcom_q6v5_mss.c | 8 -
> drivers/thermal/qcom/Kconfig | 13 +
> drivers/thermal/qcom/Makefile | 1 +
> drivers/thermal/qcom/qmi-cooling.c | 520 +++++++++++++++++++++
> drivers/thermal/qcom/qmi-cooling.h | 428 +++++++++++++++++
> 10 files changed, 1161 insertions(+), 8 deletions(-)
> ---
> base-commit: 9067f80db58bbce81d5f0703aa2fd261e88bc812
>
> // Caleb (they/them)
>
--
மணிவண்ணன் சதாசிவம்
next prev parent reply other threads:[~2023-10-01 15:57 UTC|newest]
Thread overview: 24+ messages / expand[flat|nested] mbox.gz Atom feed top
2023-09-29 16:16 [PATCH 0/4] thermal: Introduce Qualcomm Thermal Mitigation Device support Caleb Connolly
2023-09-29 16:16 ` [PATCH 1/4] remoteproc: qcom: probe all child devices Caleb Connolly
2023-09-29 16:16 ` [PATCH 2/4] dt-bindings: thermal: Add qcom,qmi-cooling yaml bindings Caleb Connolly
2023-09-29 17:15 ` Rob Herring
2023-11-07 3:55 ` Bjorn Andersson
2023-09-29 16:16 ` [PATCH 3/4] thermal: qcom: add qmi-cooling driver Caleb Connolly
2023-09-29 16:28 ` Konrad Dybcio
2023-09-29 16:56 ` Caleb Connolly
2023-10-16 21:10 ` Daniel Lezcano
2023-09-29 16:16 ` [PATCH 4/4] MAINTAINERS: Add entry for Qualcomm Cooling Driver Caleb Connolly
2023-09-29 17:17 ` [PATCH 0/4] thermal: Introduce Qualcomm Thermal Mitigation Device support Konrad Dybcio
2023-09-29 18:27 ` Caleb Connolly
2023-10-01 15:57 ` Manivannan Sadhasivam [this message]
2023-10-01 17:26 ` Caleb Connolly
2023-10-02 14:52 ` Manivannan Sadhasivam
2023-10-02 15:00 ` Dmitry Baryshkov
2023-10-02 15:14 ` Caleb Connolly
2023-10-02 15:58 ` Manivannan Sadhasivam
2023-10-02 16:00 ` Dmitry Baryshkov
2023-10-02 16:13 ` Manivannan Sadhasivam
2023-10-02 16:28 ` Neil Armstrong
2023-10-05 2:36 ` Bjorn Andersson
2023-10-10 12:24 ` Manivannan Sadhasivam
2023-10-05 2:52 ` Bjorn Andersson
Reply instructions:
You may reply publicly to this message via plain-text email
using any one of the following methods:
* Save the following mbox file, import it into your mail client,
and reply-to-all from there: mbox
Avoid top-posting and favor interleaved quoting:
https://en.wikipedia.org/wiki/Posting_style#Interleaved_style
* Reply using the --to, --cc, and --in-reply-to
switches of git-send-email(1):
git send-email \
--in-reply-to=20231001155701.GA53767@thinkpad \
--to=mani@kernel.org \
--cc=agross@kernel.org \
--cc=amitk@kernel.org \
--cc=andersson@kernel.org \
--cc=bhupesh.linux@gmail.com \
--cc=caleb.connolly@linaro.org \
--cc=conor+dt@kernel.org \
--cc=daniel.lezcano@linaro.org \
--cc=devicetree@vger.kernel.org \
--cc=konrad.dybcio@linaro.org \
--cc=krzysztof.kozlowski+dt@linaro.org \
--cc=linux-arm-msm@vger.kernel.org \
--cc=linux-pm@vger.kernel.org \
--cc=linux-remoteproc@vger.kernel.org \
--cc=mathieu.poirier@linaro.org \
--cc=quic_sibis@quicinc.com \
--cc=rafael@kernel.org \
--cc=robh+dt@kernel.org \
--cc=rui.zhang@intel.com \
--cc=thara.gopinath@gmail.com \
/path/to/YOUR_REPLY
https://kernel.org/pub/software/scm/git/docs/git-send-email.html
* If your mail client supports setting the In-Reply-To header
via mailto: links, try the mailto: link
Be sure your reply has a Subject: header at the top and a blank line
before the message body.
This is an external index of several public inboxes,
see mirroring instructions on how to clone and mirror
all data and code used by this external index.