From: Francesco Dolcini <francesco@dolcini.it>
To: Neha Malcom Francis <n-francis@ti.com>
Cc: Dhruva Gole <d-gole@ti.com>,
u-boot@lists.denx.de, Tom Rini <trini@konsulko.com>,
Vibhore Vardhan <vibhore@ti.com>,
Kamlesh Gurudasani <kamlesh@ti.com>
Subject: Re: [PATCH 2/2] arm: dts: k3: binman: am625: add support for signing TIFSSTUB Images
Date: Thu, 4 Apr 2024 10:07:45 +0200 [thread overview]
Message-ID: <20240404080745.GA7072@francesco-nb> (raw)
In-Reply-To: <967ef615-58f8-48e7-bb8e-1c9903e771db@ti.com>
On Thu, Apr 04, 2024 at 10:20:21AM +0530, Neha Malcom Francis wrote:
> On 03/04/24 17:33, Dhruva Gole wrote:
> > From: Kamlesh Gurudasani <kamlesh@ti.com>
> >
> > Add support for signing of TIFSSTUB images for HSSE, HSFS and GP devices
> > and include them in tispl.bin and tispl.bin_unsigned.
> >
> > Signed-off-by: Kamlesh Gurudasani <kamlesh@ti.com>
> > Signed-off-by: Dhruva Gole <d-gole@ti.com>
[...]
> > @@ -270,7 +406,8 @@
> > conf-0 {
> > description = "k3-am625-sk";
> > firmware = "atf";
> > - loadables = "tee", "dm", "spl";
> > + loadables = "tee", "tifsstub-hs", "tifsstub-fs",
> > + "tifsstub-gp", "dm", "spl";
> > fdt = "fdt-0";
> > };
> > };
>
>
> If there are multiple boards that will support TIFSSTUB in future, I would
I would assume that this will be the case. Verdin AM62 would need the
same, for example.
Francesco
next prev parent reply other threads:[~2024-04-04 8:07 UTC|newest]
Thread overview: 8+ messages / expand[flat|nested] mbox.gz Atom feed top
2024-04-03 12:03 [PATCH 0/2] Add TIFS Stub support in AM62x Dhruva Gole
2024-04-03 12:03 ` [PATCH 1/2] arm: mach-k3: add support for detecting TIFSSTUB images Dhruva Gole
2024-04-04 4:24 ` Neha Malcom Francis
2024-04-03 12:03 ` [PATCH 2/2] arm: dts: k3: binman: am625: add support for signing TIFSSTUB Images Dhruva Gole
2024-04-04 4:50 ` Neha Malcom Francis
2024-04-04 8:07 ` Francesco Dolcini [this message]
2024-04-04 8:22 ` Dhruva Gole
2024-04-12 14:19 ` [PATCH 0/2] Add TIFS Stub support in AM62x Tom Rini
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