Re: [PATCH v3] usb: dwc3: qcom: Remove extcon functionality from glue

[Greg Kroah-Hartman <gregkh@linuxfoundation.org>]

On Mon, Jul 14, 2025 at 10:17:02AM +0530, Krishna Kurapati wrote:
> Deprecate usage of extcon functionality from the glue driver. Now
> that the glue driver is a flattened implementation, all existing
> DTs would eventually move to new bindings. While doing so let them
> make use of role-switch/ typec frameworks to provide role data
> rather than using extcon.

"Deprecate"?  Looks like you are just deleting all of this code, what is
going to break when this is removed?  Are there any in-kernel users of
it?

> On upstream, summary of targets/platforms using extcon is as follows:
> 
> 1. MSM8916 and MSM8939 use Chipidea controller, hence the changes have no
> effect on them.

Ok, so those are fine, but:

> 2. Of the other extcon users, most of them use "linux,extcon-usb-gpio"
> driver which relies on id/vbus gpios to inform role changes. This can be
> transitioned to role switch based driver (usb-conn-gpio) while flattening
> those platforms to move away from extcon and rely on role
> switching.

When is that going to happen?  Where are those patches?

> 3. The one target that uses dwc3 controller and extcon and is not based
> on reading gpios is "arch/arm64/boot/dts/qcom/msm8996-xiaomi-common.dtsi".
> This platform uses TI chip to provide extcon. If usb on this platform is
> being flattneed, then effort should be put in to define a usb-c-connector
> device in DT and make use of role switch functionality in TUSB320L driver.

Again, when is that going to be changed?  We can't break in-kernel users
:(

thanks,

greg k-h