Re: [PATCH v4 01/10] dt-bindings: firmware: qcom: tmd: add TMD device type constants

[Krzysztof Kozlowski <krzk@kernel.org>]

On Fri, Jul 03, 2026 at 10:33:04AM +0530, Gaurav Kohli wrote:
> Add Device Tree binding constants for Qualcomm Thermal Mitigation
> Device (TMD) types used by remoteproc-backed thermal cooling devices.
> 
> Qualcomm remote processors expose thermal mitigation endpoints
> through QMI. These endpoints can be registered with the thermal
> framework via the `#cooling-cells` property on the remoteproc node.
> 
> The QMI TMD protocol identifies devices using string names (for example,
> "pa", "modem", and "cdsp_sw"), while the DT cooling-device binding with
> `#cooling-cells = <3>` requires numeric device id in the form:
> 
>   <&phandle device_id min_state max_state>
> 
> Define common TMD device index constants shared across currently
> supported platforms. If a future target requires a different mapping,
> additional target-specific constants can be introduced while preserving
> existing DT ABI.
> 
> Signed-off-by: Gaurav Kohli <gaurav.kohli@oss.qualcomm.com>
> ---
>  MAINTAINERS                                 |  1 +
>  include/dt-bindings/firmware/qcom,qmi-tmd.h | 20 ++++++++++++++++++++

Why is it put into firmware? What part of firmware are you describing?
To me it looks like thermal thing and even you wrote: Thermal Mitigation Device

Best regards,
Krzysztof