From mboxrd@z Thu Jan 1 00:00:00 1970 From: Rudolf Marek Date: Mon, 07 Jul 2008 21:04:55 +0000 Subject: Re: [lm-sensors] New winbond chip: W83667HG Message-Id: <487284F7.5030504@assembler.cz> List-Id: References: <200807072054.10321.phhusson@free.fr> In-Reply-To: <200807072054.10321.phhusson@free.fr> MIME-Version: 1.0 Content-Type: text/plain; charset="us-ascii" Content-Transfer-Encoding: 7bit To: lm-sensors@vger.kernel.org Hello Gong Jun, Sorry I forgot what is your first name. I think Jun, but not sure ;) Would you be so kind and get us a datasheet for the W83667HG? Please just send it to me Jean and David (usual suspects ;). The chip seems to be similar to W83627EHG/DHG. Best would be to get some diff documentation - eg what is different from previous generation, like we had for DHG. I dont have much time left, but I can at least try to help with the support/implementation. If it is easy/doable in short time I can even do that. If you have some public version of datasheet please ask to put it on the Winbond site. I dont know if binary attachments are allowed for mailing list. Thank you, Rudolf _______________________________________________ lm-sensors mailing list lm-sensors@lm-sensors.org http://lists.lm-sensors.org/mailman/listinfo/lm-sensors