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From: Wei Ni <wni@nvidia.com>
To: Eduardo Valentin <eduardo.valentin@ti.com>
Cc: "linux-pm@vger.kernel.org" <linux-pm@vger.kernel.org>,
	"durgadoss.r@intel.com" <durgadoss.r@intel.com>,
	"amit.daniel@samsung.com" <amit.daniel@samsung.com>,
	"rui.zhang@intel.com" <rui.zhang@intel.com>,
	"linux-kernel@vger.kernel.org" <linux-kernel@vger.kernel.org>
Subject: Re: [RFC PATCH 2/4] thermal: introduce device tree parser
Date: Wed, 10 Jul 2013 14:48:40 +0800	[thread overview]
Message-ID: <51DD03C8.1090207@nvidia.com> (raw)
In-Reply-To: <1373378414-28086-3-git-send-email-eduardo.valentin@ti.com>

On 07/09/2013 10:00 PM, Eduardo Valentin wrote:
> In order to be able to build thermal policies
> based on generic sensors, like I2C device, that
> can be places in different points on different boards,
> there is a need to have a way to feed board dependent
> data into the thermal framework.
> 
> This patch introduces a thermal data parser for device
> tree. The parsed data is used to build thermal zones
> and thermal binding parameters. The output data
> can then be used to deploy thermal policies.
> 
> This patch adds also documentation regarding this
> API and how to define define tree nodes to use
> this infrastructure.

It looks good, with this infrastructure, we can add generic sensor
driver into the thermal fw easily.


> +
> +Below is an example:
> +thermal_zone {
> +            type = "CPU";
> +            mask = <0x03>; /* trips writability */
> +            passive_delay = <250>; /* milliseconds */
> +            polling_delay = <1000>; /* milliseconds */
> +            governor = "step_wise";
> +            trips {
> +                    alert@100000{
> +                            temperature = <100000>; /* milliCelsius */
> +                            hysteresis = <0>; /* milliCelsius */
> +                            type = <1>;

how about to use the trip type name directly, such as named as
"passive-trip;", I think it's more readable. for example:
trip0 {
....
passive-trip;
}
trip1 {
....
active-trip;
}

> +                    };
> +                    crit@125000{
> +                            temperature = <125000>; /* milliCelsius */
> +                            hysteresis = <0>; /* milliCelsius */
> +                            type = <3>;
> +                    };
> +            };
> +            bind_params {
> +                    action@0{
> +                            cooling_device = "thermal-cpufreq";
> +                            weight = <100>; /* percentage */
> +                            mask = <0x01>;
> +                    };
> +            };
> +};

as we know, thermal_zone_bind_cooling_device() will set the upper/lower
in the thermal_instance. In the default .bind function, it just set to
THERMAL_NO_LIMIT, but for some platform, it need to set these
upper/lower values for different cooling device and trips, how to pass
these values in DT? how about to set:
action@0 {
...
mask = <0x03>; //or you can remove this property;
trip0 = <&alert 1 2>; //1 is lower value, 2 is upper value;
trip1 = <&crit 3 4>;
}


Thanks.
Wei.


  parent reply	other threads:[~2013-07-10  6:48 UTC|newest]

Thread overview: 33+ messages / expand[flat|nested]  mbox.gz  Atom feed  top
2013-07-09 14:00 [RFC PATCH 0/4] thermal: introduce DT thermal builder Eduardo Valentin
2013-07-09 14:00 ` [RFC PATCH 1/4] thermal: hwmon: move hwmon support to single file Eduardo Valentin
2013-07-09 14:00   ` Eduardo Valentin
2013-07-09 16:04   ` R, Durgadoss
2013-07-09 16:54     ` Eduardo Valentin
2013-07-09 17:14       ` R, Durgadoss
2013-07-17  9:49       ` Wei Ni
2013-07-17 10:07         ` R, Durgadoss
2013-08-15  6:21   ` Zhang Rui
2013-07-09 14:00 ` [RFC PATCH 2/4] thermal: introduce device tree parser Eduardo Valentin
2013-07-09 14:00   ` Eduardo Valentin
2013-07-09 16:14   ` R, Durgadoss
2013-07-17 14:51     ` Eduardo Valentin
2013-07-10  6:48   ` Wei Ni [this message]
2013-07-10 15:16     ` Stephen Warren
2013-07-15 14:30       ` Eduardo Valentin
2013-07-15 11:54     ` Eduardo Valentin
2013-07-15 17:03       ` R, Durgadoss
2013-07-15 17:16         ` Eduardo Valentin
2013-07-09 14:00 ` [RFC PATCH 3/4] thermal: ti-soc-thermal: use thermal DT infrastructure Eduardo Valentin
2013-07-15 12:12   ` Lucas Stach
2013-07-15 12:33     ` Eduardo Valentin
2013-07-15 12:59       ` Lucas Stach
2013-07-15 13:25         ` Eduardo Valentin
2013-07-15 13:36           ` Eduardo Valentin
2013-07-15 13:38             ` Eduardo Valentin
2013-07-15 14:05             ` Lucas Stach
2013-07-15 14:14               ` Eduardo Valentin
2013-07-16  9:54                 ` Lucas Stach
2013-07-16 13:29                   ` Eduardo Valentin
2013-07-15 13:53           ` Lucas Stach
2013-07-15 14:09             ` Eduardo Valentin
2013-07-09 14:00 ` [RFC PATCH 4/4] arm: dts: add omap4430 thermal data Eduardo Valentin

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