From: xuwei5@hisilicon.com (Wei Xu)
To: linux-arm-kernel@lists.infradead.org
Subject: [GIT PULL] arm64: dts: hisilicon dts updates for v4.19
Date: Thu, 19 Jul 2018 10:52:53 +0100 [thread overview]
Message-ID: <5B505F75.1050200@hisilicon.com> (raw)
In-Reply-To: <5B4F6398.2070608@hisilicon.com>
Hi Olof, Hi Arnd,
Please ignore this pull request since Viresh expected the thermal
binding patch is going via the thermal core maintainers.
I will send v2 and drop those 2 patches.
Sorry for the noise!
Best Regards,
Wei
On 2018/7/18 16:58, Wei Xu wrote:
> Hi Olof, Hi Arnd,
>
> Please consider to pull the following changes.
> I rebased the pull on hisi-fixes-for-4.18 since there are
> some fixes for v4.18 have been merged.
>
> Thanks!
>
> Best Regards,
> Wei
>
> ---
> The following changes since commit a30449eb3ac908f26b4bc963a58039a5f2725ffa:
>
> arm64: dts: hikey960: Define wl1837 power capabilities (2018-06-28 17:07:44 +0100)
>
> are available in the Git repository at:
>
> git://github.com/hisilicon/linux-hisi.git tags/hisi-arm64-dt-for-4.19
>
> for you to fetch changes up to 168124aa0b430dce963d9a9e3dba44cb81a8159e:
>
> arm64: dts: hi6220: Add all CPUs in cooling maps (2018-07-17 13:58:17 +0100)
>
> ----------------------------------------------------------------
> ARM64: DT: Hisilicon SoC DT updates for 4.19
>
> - Tidy up MMC properties for hi3660
> - Remove keep-power-in-suspend on hikey and hikey960 to
> avoid keeping wifi power during suspend and let the
> user enable it if required
> - Update idle states for hikey960
> - Add missing cooling device properties for cpus on hi6220
> - Update thermal dt binding to allow multiple devices
> to share cooling map
> - Add all cpus in the cooling maps for hi6220
>
> ----------------------------------------------------------------
> Vincent Guittot (1):
> arm64: hikey960: update idle-states
>
> Viresh Kumar (3):
> arm64: dts: hisilicon: Add missing cooling device properties for CPUs
> dt-bindings: thermal: Allow multiple devices to share cooling map
> arm64: dts: hi6220: Add all CPUs in cooling maps
>
> oscardagrach (4):
> arm64: dts: hikey960: Remove deprecated MMC properties
> arm64: dts: hikey960: Clean up MMC properties and move to proper file
> arm64: dts: hikey960: Remove keep-power-in-suspend property
> arm64: dts: hikey: Remove keep-power-in-suspend property
>
> .../devicetree/bindings/thermal/thermal.txt | 11 +--
> arch/arm64/boot/dts/hisilicon/hi3660-hikey960.dts | 26 +++++--
> arch/arm64/boot/dts/hisilicon/hi3660.dtsi | 79 +++++++++-------------
> arch/arm64/boot/dts/hisilicon/hi6220-hikey.dts | 1 -
> arch/arm64/boot/dts/hisilicon/hi6220.dtsi | 25 ++++++-
> 5 files changed, 78 insertions(+), 64 deletions(-)
>
>
prev parent reply other threads:[~2018-07-19 9:52 UTC|newest]
Thread overview: 2+ messages / expand[flat|nested] mbox.gz Atom feed top
2018-07-18 15:58 [GIT PULL] arm64: dts: hisilicon dts updates for v4.19 Wei Xu
2018-07-19 9:52 ` Wei Xu [this message]
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