From: Simon Horman <simon.horman@corigine.com>
To: Daniel Lezcano <daniel.lezcano@linaro.org>
Cc: rafael@kernel.org, linux-pm@vger.kernel.org,
thierry.reding@gmail.com, Sandipan Patra <spatra@nvidia.com>,
Gal Pressman <gal@nvidia.com>, Saeed Mahameed <saeedm@nvidia.com>,
Jakub Kicinski <kuba@kernel.org>,
Leon Romanovsky <leon@kernel.org>,
"David S. Miller" <davem@davemloft.net>,
Eric Dumazet <edumazet@google.com>,
Paolo Abeni <pabeni@redhat.com>,
"open list:MELLANOX MLX5 core VPI driver"
<netdev@vger.kernel.org>,
"open list:MELLANOX MLX5 core VPI driver"
<linux-rdma@vger.kernel.org>,
open list <linux-kernel@vger.kernel.org>
Subject: Re: [PATCH 1/8] net/mlx5: Update the driver with the recent thermal changes
Date: Fri, 26 May 2023 11:20:30 +0200 [thread overview]
Message-ID: <ZHB53sm0od4RvsKe@corigine.com> (raw)
In-Reply-To: <20230525140135.3589917-2-daniel.lezcano@linaro.org>
On Thu, May 25, 2023 at 04:01:28PM +0200, Daniel Lezcano wrote:
> The thermal framework is migrating to the generic trip points. The set
> of changes also implies a self-encapsulation of the thermal zone
> device structure where the internals are no longer directly accessible
> but with accessors.
>
> Use the new API instead, so the next changes can be pushed in the
> thermal framework without this driver failing to compile.
>
> No functional changes intended.
>
> Cc: Sandipan Patra <spatra@nvidia.com>
> Cc: Gal Pressman <gal@nvidia.com>
> Cc: Saeed Mahameed <saeedm@nvidia.com>
> Cc: Jakub Kicinski <kuba@kernel.org>
> Signed-off-by: Daniel Lezcano <daniel.lezcano@linaro.org>
Reviewed-by: Simon Horman <simon.horman@corigine.com>
next prev parent reply other threads:[~2023-05-26 9:20 UTC|newest]
Thread overview: 23+ messages / expand[flat|nested] mbox.gz Atom feed top
2023-05-25 14:01 [PATCH 0/8] Finish thermal zone structure encapsulation Daniel Lezcano
2023-05-25 14:01 ` [PATCH 1/8] net/mlx5: Update the driver with the recent thermal changes Daniel Lezcano
2023-05-26 9:20 ` Simon Horman [this message]
2023-05-31 22:10 ` Saeed Mahameed
2023-06-07 13:17 ` Daniel Lezcano
2023-05-25 14:01 ` [PATCH 2/8] thermal/core: Hardening the self-encapsulation Daniel Lezcano
2023-05-25 14:01 ` [PATCH 3/8] thermal/core: Reorder the headers inclusion Daniel Lezcano
2023-05-25 14:01 ` [PATCH 4/8] thermal/core: Update the generic trip points Daniel Lezcano
2023-06-20 11:28 ` Rafael J. Wysocki
2023-06-20 18:35 ` Daniel Lezcano
2023-06-23 17:59 ` Rafael J. Wysocki
2023-06-25 20:29 ` Rafael J. Wysocki
2023-05-25 14:01 ` [PATCH 5/8] thermal/drivers/int3400: Use thermal zone device wrappers Daniel Lezcano
2023-07-03 10:49 ` Daniel Lezcano
2023-07-03 16:15 ` srinivas pandruvada
2023-07-05 10:41 ` Daniel Lezcano
2023-07-05 11:35 ` srinivas pandruvada
2023-07-05 11:49 ` Daniel Lezcano
2023-05-25 14:01 ` [PATCH 6/8] thermal/drivers/int340x: Do not check the thermal zone state Daniel Lezcano
2023-05-25 14:01 ` [PATCH 7/8] thermal/drivers/int340x: Use thermal zone device trip update Daniel Lezcano
2023-05-25 14:01 ` [PATCH 8/8] thermal/core: Move the thermal zone structure to the private core header Daniel Lezcano
2023-06-13 14:12 ` [PATCH 0/8] Finish thermal zone structure encapsulation Daniel Lezcano
2023-06-20 10:54 ` Rafael J. Wysocki
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