Re: [PATCH v2 3/3] arm64: dts: qcom: sdm670: add thermal zones and thermal devices

[Richard Acayan <mailingradian@gmail.com>]

On Wed, Mar 04, 2026 at 03:55:21AM +0200, Dmitry Baryshkov wrote:
> On Tue, Mar 03, 2026 at 08:45:30PM -0500, Richard Acayan wrote:
> > Add thermal zones to safeguard from overheating to high temperatures,
> > along with the thermal sensors (TSENS) and CPU frequency limits (LMh).
> > The temperatures are very high, but should still be safeguard for
> > devices that do not specify their own thermal zones.
> > 
> > Signed-off-by: Richard Acayan <mailingradian@gmail.com>
> > ---
> >  arch/arm64/boot/dts/qcom/sdm670.dtsi | 474 +++++++++++++++++++++++++++
> >  1 file changed, 474 insertions(+)
> > 
> > +
> > +		mem-thermal {
> > +			polling-delay-passive = <250>;
> > +			polling-delay = <1000>;
> > +
> > +			thermal-sensors = <&tsens1 2>;
> > +
> > +			cooling-maps {
> > +				map0 {
> > +					trip = <&mem_alert0>;
> > +					cooling-device = <&cpu6 THERMAL_NO_LIMIT THERMAL_NO_LIMIT>,
> > +							 <&cpu7 THERMAL_NO_LIMIT THERMAL_NO_LIMIT>;
> 
> Why is it only cpu6 & 7?

They are supposed to have the highest available power consumption
(implying highest TDP).

> Note, SDM845 doesn't have any cooling maps for
> mem-thermal.

Makes sense, the cooling can be removed.