From: Frank Li <Frank.li@oss.nxp.com>
To: Haoning.CHENG@cn.bosch.com
Cc: "Rafael J. Wysocki" <rafael@kernel.org>,
Daniel Lezcano <daniel.lezcano@linaro.org>,
Zhang Rui <rui.zhang@intel.com>,
Lukasz Luba <lukasz.luba@arm.com>, Rob Herring <robh@kernel.org>,
Krzysztof Kozlowski <krzk+dt@kernel.org>,
Conor Dooley <conor+dt@kernel.org>,
Shawn Guo <shawnguo@kernel.org>,
Sascha Hauer <s.hauer@pengutronix.de>,
Pengutronix Kernel Team <kernel@pengutronix.de>,
Fabio Estevam <festevam@gmail.com>,
linux-pm@vger.kernel.org, devicetree@vger.kernel.org,
imx@lists.linux.dev, linux-arm-kernel@lists.infradead.org,
linux-kernel@vger.kernel.org
Subject: Re: [PATCH v2 1/2] dt-bindings: thermal: imx: Document calibration offset property
Date: Thu, 9 Jul 2026 10:07:21 -0500 [thread overview]
Message-ID: <ak-5KdXFUldV2eTP@SMW015318> (raw)
In-Reply-To: <20260709-b4-symana21-11221-imx-thermal-support-upstream-6-18-v2-1-00ff72495e24@cn.bosch.com>
On Thu, Jul 09, 2026 at 04:10:21PM +0800, HaoNing Cheng via B4 Relay wrote:
> [You don't often get email from devnull+haoning.cheng.cn.bosch.com@kernel.org. Learn why this is important at https://aka.ms/LearnAboutSenderIdentification ]
>
> From: HaoNing Cheng <Haoning.CHENG@cn.bosch.com>
>
> Some boards need a small per-design correction to align the reported CPU
> temperature with board-level measurements.
>
> Document the optional fsl,temp-calibration-offset-millicelsius property,
> a signed offset in millicelsius that is added to the calculated sensor
> temperature.
why board difference cause such offset, I suppose it is cause by SoC
variance. The offset may difference if you change to another chip. another
words, if you have 1000 boards, Is this offset the same?
> The property is optional and the existing behaviour is kept
> when it is omitted.
>
> Update the binding example to show its usage.
>
> Signed-off-by: HaoNing Cheng <Haoning.CHENG@cn.bosch.com>
> ---
> Documentation/devicetree/bindings/thermal/imx-thermal.yaml | 8 ++++++++
> 1 file changed, 8 insertions(+)
>
> diff --git a/Documentation/devicetree/bindings/thermal/imx-thermal.yaml b/Documentation/devicetree/bindings/thermal/imx-thermal.yaml
> index 949b154856c5..eb7243a7ebaf 100644
> --- a/Documentation/devicetree/bindings/thermal/imx-thermal.yaml
> +++ b/Documentation/devicetree/bindings/thermal/imx-thermal.yaml
> @@ -59,6 +59,13 @@ properties:
> clocks:
> maxItems: 1
>
> + fsl,temp-calibration-offset-millicelsius:
> + maxItems: 1
suppose it int32, why need maxItems here?
Frank
> + description:
> + A signed calibration offset, in millicelsius, added to the calculated
> + sensor temperature to compensate for board-level measurement
> + differences. When absent, no offset is applied.
> +
> "#thermal-sensor-cells":
> const: 0
>
> @@ -109,6 +116,7 @@ examples:
> nvmem-cells = <&tempmon_calib>, <&tempmon_temp_grade>;
> nvmem-cell-names = "calib", "temp_grade";
> clocks = <&clks IMX6SX_CLK_PLL3_USB_OTG>;
> + fsl,temp-calibration-offset-millicelsius = <(-6400)>;
> #thermal-sensor-cells = <0>;
> };
> };
>
> --
> 2.43.0
>
>
>
next prev parent reply other threads:[~2026-07-09 15:07 UTC|newest]
Thread overview: 9+ messages / expand[flat|nested] mbox.gz Atom feed top
2026-07-09 8:10 [PATCH v2 0/2] thermal: imx: Add calibration offset support HaoNing Cheng via B4 Relay
2026-07-09 8:10 ` HaoNing Cheng
2026-07-09 8:10 ` [PATCH v2 1/2] dt-bindings: thermal: imx: Document calibration offset property HaoNing Cheng via B4 Relay
2026-07-09 8:10 ` HaoNing Cheng
2026-07-09 15:07 ` Frank Li [this message]
2026-07-09 17:47 ` Conor Dooley
2026-07-09 8:10 ` [PATCH v2 2/2] thermal/drivers/imx: Add calibration offset support HaoNing Cheng via B4 Relay
2026-07-09 8:10 ` HaoNing Cheng
2026-07-09 8:22 ` sashiko-bot
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