From mboxrd@z Thu Jan 1 00:00:00 1970 From: "yangrunhua" Date: Sat, 19 Jan 2002 16:16:28 +0000 Subject: [LARTC] Does tc support bond device? MIME-Version: 1 Content-Type: multipart/mixed; boundary="----=_NextPart_000_0006_01C1A147.B4BE12B0" Message-Id: List-Id: To: lartc@vger.kernel.org This is a multi-part message in MIME format. ------=_NextPart_000_0006_01C1A147.B4BE12B0 Content-Type: text/plain; charset="us-ascii" Content-Transfer-Encoding: 7bit Hi all! Does tc support bond device ,like bond0, bond1, when kernel supports bonding and machine are correctly configured? Regards, yangrunhua ------=_NextPart_000_0006_01C1A147.B4BE12B0 Content-Type: text/html; charset="us-ascii" Content-Transfer-Encoding: quoted-printable

Hi = all!

Does tc support bond device ,like bond0, bond1, when = kernel supports bonding and machine are correctly = configured?

 

Regards,

           &nb= sp;           &nbs= p;            = ;            =             &= nbsp;           &n= bsp;           &nb= sp;           &nbs= p;            = ;            =           = yangrunhua

 

 

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