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From: sashiko-bot@kernel.org
To: "Gaurav Kohli" <gaurav.kohli@oss.qualcomm.com>
Cc: devicetree@vger.kernel.org, robh@kernel.org, conor+dt@kernel.org
Subject: Re: [PATCH v3 6/6] arm64: dts: qcom: hamoa: add thermal hw-bin support
Date: Fri, 13 Nov 2026 09:00:14 +0000	[thread overview]
Message-ID: <sashiko-outbox-212491@kernel.org> (raw)
In-Reply-To: <20261113-thermal_bin-v3-6-878df6eef8bc@oss.qualcomm.com>

Thank you for your contribution! Sashiko AI review found 1 potential
issue to consider:
- [Medium] arm64: dts: qcom: hamoa: leftover temperature overrides
  shadow temperature-bin
--

commit 35a11d22a7dfa97cb85bfddd513a803ab8607fca
Author: Amit Kucheria <amit.kucheria@oss.qualcomm.com>

arm64: dts: qcom: hamoa: add thermal hw-bin support

This commit adds the i-temp nvmem cell to hamoa.dtsi, wires the tsens
controllers to it, and switches the GPU passive trip points to use
temperature-bin and thermal-hw-bin instead of board-specific overrides.

> diff --git a/arch/arm64/boot/dts/qcom/hamoa.dtsi b/arch/arm64/boot/dts/qcom/hamoa.dtsi
> index 443c1a5c212d9..e25729ff23c87 100644
> --- a/arch/arm64/boot/dts/qcom/hamoa.dtsi
> +++ b/arch/arm64/boot/dts/qcom/hamoa.dtsi

[ ... ]

> @@ -9751,7 +9769,8 @@ map0 {
>  
>  			trips {
>  				gpuss0_alert0: trip-point0 {
> -					temperature = <95000>;
> +					temperature-bin = <95000>, <105000>;
> +					thermal-hw-bin = <0x1>, <0x2>;
>  					hysteresis = <1000>;
>  					type = "passive";
>  				};

[Severity: Medium]
Should the GPU trip-point0 temperature overrides also be removed from
hamoa-advantech-som-db5830.dts, hamoa-som-db5830.dts, and
purwa-iot-evk.dts?

Those boards include hamoa.dtsi and still set temperature = <105000> on
their GPU trip-point0 nodes.  Because temperature and temperature-bin are
distinct properties, the compiled DTBs retain both on the same trip node,
which violates the oneOf schema constraint in thermal-zones.yaml and causes
thermal_of_trip_read_temperature() to read the scalar temperature property
first, bypassing temperature-bin selection on standard-bin parts.

-- 
Sashiko AI review · https://sashiko.dev/#/patchset/20261113-thermal_bin-v3-0-878df6eef8bc@oss.qualcomm.com?part=6

      reply	other threads:[~2026-11-13  9:00 UTC|newest]

Thread overview: 11+ messages / expand[flat|nested]  mbox.gz  Atom feed  top
2026-11-13  8:43 [PATCH v3 0/6] thermal: Add hardware-binned trip point support Gaurav Kohli
2026-11-13  8:43 ` [PATCH v3 1/6] dt-bindings: thermal: thermal-zones: add hardware-binning trip properties Gaurav Kohli
2026-11-13  8:43 ` [PATCH v3 2/6] thermal: add hardware-binning trip-point filtering support Gaurav Kohli
2026-11-13  9:01   ` sashiko-bot
2026-11-13  8:43 ` [PATCH v3 3/6] dt-bindings: thermal: qcom-tsens: document qcm6490 tsens Gaurav Kohli
2026-11-13  8:43 ` [PATCH v3 4/6] thermal: qcom: tsens: add hardware-bin trip-point filtering Gaurav Kohli
2026-11-13  8:55   ` sashiko-bot
2026-11-13  8:43 ` [PATCH v3 5/6] arm64: dts: qcom: kodiak: use thermal hw-bin trips Gaurav Kohli
2026-11-13  8:59   ` sashiko-bot
2026-11-13  8:43 ` [PATCH v3 6/6] arm64: dts: qcom: hamoa: add thermal hw-bin support Gaurav Kohli
2026-11-13  9:00   ` sashiko-bot [this message]

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