Re: [PATCH v3 2/2] dt-bindings: mfd: Add properties for thermal sensor cells

[Krzysztof Kozlowski <krzk@kernel.org>]

On 13/11/2024 04:05, Guenter Roeck wrote:
> On 11/12/24 18:39, Sung-Chi, Li wrote:
>> The cros_ec supports reading thermal values from thermal sensors
>> connect to it. Add the property '#thermal-sensor-cells' bindings, such
>> that thermal framework can recognize cros_ec as a valid thermal device.
>>
>> Signed-off-by: Sung-Chi, Li <lschyi@chromium.org>
>> Acked-by: Conor Dooley <conor.dooley@microchip.com>
>> ---
>>   Changes in v2:
>>     - Add changes for DTS binding.
>>   Changes in v3:
>>     - Remove unneeded Change-Id tag in commit message.
>> ---
> 
> I can't apply this one (not in hwmon space), so
> 
> Acked-by: Guenter Roeck <linux@roeck-us.net>
> 
> with the assumption that Lee will pick it up.

This was merged, while I was AFK, so the ship has sailed, but let me
state here objection for any future discussions:

NAK, this is not a thermal sensor. The commit msg explains what they
want to achieve, but that's not a valid reason to add property from
different class of devices.

This is some hardware/temperature monitoring device or power supply, not
part of SoC, not integrated into any SoC thermal zone. Calling it
thermal sensor is huge stretch and inappropriate hardware description
leading to next patches like calling it a SoC cooling device, instead of
simple power supply (for which we have bindings!).

Best regards,
Krzysztof