From mboxrd@z Thu Jan  1 00:00:00 1970
From: Bruce Richardson <bruce.richardson@intel.com>
Subject: Re: [PATCH V3 0/4] bonding: fixes and enhancements
Date: Thu, 10 Mar 2016 15:41:41 +0000
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To: Eric Kinzie <ehkinzie@gmail.com>
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On Tue, Mar 01, 2016 at 09:31:58AM -0800, Eric Kinzie wrote:
> These are bug fixes and some small enhancements to allow bonding
> to work with external control (teamd). Please consider integrating
> these into DPDK 2.2
> 
> Changes in v2:
> - remove "bond: handle slaves with fewer queues than bonding device"
> - remove "bond: per-slave intermediate rx ring"
> 
> Changes in v3:
> This version has only fixes.  Patches with new functionality have been
> removed and will be submitted separately.
> - remove "bond mode 4: allow external state machine"
> - remove "bond: use existing enslaved device queues"
> 
> Eric Kinzie (4):
>   bond mode 4: copy entire config structure
>   bond mode 4: do not ignore multicast
>   bond: active slaves with no primary
>   bond: do not activate slave twice
> 
>  app/test/test_link_bonding_mode4.c        |  7 +++++--
>  drivers/net/bonding/rte_eth_bond_8023ad.c |  1 +
>  drivers/net/bonding/rte_eth_bond_api.c    | 13 +++++++++++--
>  drivers/net/bonding/rte_eth_bond_pmd.c    |  1 +
>  4 files changed, 18 insertions(+), 4 deletions(-)
> 
> -- 
> 2.1.4
> 
Applied to dpdk-next-net/rel_16_04

/Bruce