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From: "Jastrzebski, MichalX K" <michalx.k.jastrzebski@intel.com>
Subject: Re: [PATCH] app/test: fix bond device name too long
Date: Wed, 8 Jun 2016 11:50:01 +0000
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To: Thomas Monjalon <thomas.monjalon@6wind.com>, "Iremonger, Bernard"
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> -----Original Message-----
> From: Thomas Monjalon [mailto:thomas.monjalon@6wind.com]
> Sent: Wednesday, June 08, 2016 12:40 PM
> To: Jastrzebski, MichalX K <michalx.k.jastrzebski@intel.com>; Iremonger,
> Bernard <bernard.iremonger@intel.com>
> Cc: dev@dpdk.org
> Subject: Re: [dpdk-dev] [PATCH] app/test: fix bond device name too long
>=20
> 2016-05-27 18:38, Thomas Monjalon:
> > 2016-05-27 17:20, Michal Jastrzebski:
> > > Bond device name was too long (grather than 32 signs) that
> > > cause mempool allocation to fail.
> >
> > Maybe that this kind of failure would be avoided if the test
> > was added to autotests (app/test/autotest_data.py).
> >
> > Generally speaking, it would be a good idea to make an audit
> > on which tests are missing in "make fast_test" and "make test".
>=20
> Any comment please?

Hi Thomas,

There is a small timeout in test_tlb_tx_burst - big burst has to be generat=
ed to
detect balancing and small timeout has to be included between each burst,=20
thus I am not sure if link_bonding_autotest can be classified to fast tests=
=20
(test takes about 3-4 seconds).
We can add this test to autotests script for which time is not so critical.

Best regards
Michal