[DPDK/ethdev Bug 1699] Bonding device documentation missing

[DPDK/ethdev Bug 1699] Bonding device documentation missing

[bugzilla]

[-- Attachment #1: Type: text/plain, Size: 601 bytes --]

https://bugs.dpdk.org/show_bug.cgi?id=1699

            Bug ID: 1699
           Summary: Bonding device documentation missing
           Product: DPDK
           Version: 25.03
          Hardware: All
                OS: All
            Status: UNCONFIRMED
          Severity: minor
          Priority: Normal
         Component: ethdev
          Assignee: dev@dpdk.org
          Reporter: stephen@networkplumber.org
  Target Milestone: ---

There is no entry in the PMD feature matrix for bonding device.

-- 
You are receiving this mail because:
You are the assignee for the bug.

[-- Attachment #2: Type: text/html, Size: 2465 bytes --]

[DPDK/ethdev Bug 1699] Bonding device documentation missing

[bugzilla]

http://bugs.dpdk.org/show_bug.cgi?id=1699

Stephen Hemminger (stephen@networkplumber.org) changed:

           What    |Removed                     |Added
----------------------------------------------------------------------------
         Resolution|---                         |INVALID
             Status|UNCONFIRMED                 |RESOLVED

--- Comment #1 from Stephen Hemminger (stephen@networkplumber.org) ---
This NIC was dropped from table intentionally by:

commit 7b103c4ccd98e3f3d457c74960acd28dac64392d
Author: Thomas Monjalon <thomas@monjalon.net>
Date:   Thu Mar 12 00:01:35 2020 +0100

    doc: remove empty columns from NIC features matrix

    The virtual PMDs bonding, KNI, null, ring, softnic and vdev_netvsc
    have no real feature to advertise so they can be removed
    from the (too) big matrix of ethdev features.

    Signed-off-by: Thomas Monjalon <thomas@monjalon.net>

-- 
You are receiving this mail because:
You are the assignee for the bug.