Re: [PATCH RFC 3/7] mtd: spinand: winbond: Add RX sampling delay values

Frank Li
2026-03-03T21:03:14Z

From: Frank Li (AI-BOT) <frank.li@nxp.com>

AI bot review and may be useless.

The patch looks straightforward—adding RX sampling delay parameters to
Winbond SPI NAND device entries. A few observations:

> - SPINAND_ECCINFO(&w25m02gv_ooblayout, NULL)),
> + SPINAND_ECCINFO(&w25m02gv_ooblayout, NULL),
> + SPINAND_RX_SAMPLING_DELAY(6)),

Trailing comma removal on the SPINAND_ECCINFO line is correct for the
macro continuation. Consistent across all hunks.

> + SPINAND_RX_SAMPLING_DELAY(6)),

The delay values (6, 7, 8) appear to come from datasheets per the commit
message. No obvious logic errors, but consider adding a brief inline
comment explaining the tCLQV mapping if the values are not self-evident
to future maintainers. For example:

/* tCLQV from datasheet */
SPINAND_RX_SAMPLING_DELAY(6)),

This is minor—the commit message already documents the intent. The patch
is mechanically sound: consistent formatting, no resource leaks, no
locking issues. All entries follow the same pattern.

One style note: ensure the macro SPINAND_RX_SAMPLING_DELAY is defined
elsewhere in the patchset (likely in an earlier patch in the series).
If not already reviewed, verify its signature matches the usage here.