Re: [PATCH v1 10/13] thermal: core: Allow trip pointers to be used for cooling device binding

Daniel Lezcano
2023-09-28T07:12:41Z

On 21/09/2023 20:01, Rafael J. Wysocki wrote:
> From: Rafael J. Wysocki <rafael.j.wysocki@intel.com>
>
> Add new helper functions, thermal_bind_cdev_to_trip() and
> thermal_unbind_cdev_from_trip(), to allow a trip pointer to be used for
> binding a cooling device to a trip point and unbinding it, respectively,
> and redefine the existing helpers, thermal_zone_bind_cooling_device()
> and thermal_zone_unbind_cooling_device(), as wrappers around the new
> ones, respectively.
>
> No intentional functional impact.
>
> Signed-off-by: Rafael J. Wysocki <rafael.j.wysocki@intel.com>
> ---

Reviewed-by: Daniel Lezcano <daniel.lezcano@linaro.org>

--
<http://www.linaro.org/> Linaro.org │ Open source software for ARM SoCs

Follow Linaro: <http://www.facebook.com/pages/Linaro> Facebook |
<http://twitter.com/#!/linaroorg> Twitter |