From mboxrd@z Thu Jan 1 00:00:00 1970 From: Guenter Roeck Subject: Re: [lm-sensors] [PATCH 3/4] thermal: exynos4: Register the tmu sensor with the thermal interface layer Date: Sat, 3 Mar 2012 06:55:38 -0800 Message-ID: <20120303145538.GB29335@ericsson.com> References: <1330772767-16120-1-git-send-email-amit.kachhap@linaro.org> <1330772767-16120-4-git-send-email-amit.kachhap@linaro.org> Mime-Version: 1.0 Content-Type: text/plain; charset="us-ascii" Return-path: Received: from imr3.ericy.com ([198.24.6.13]:35203 "EHLO imr3.ericy.com" rhost-flags-OK-OK-OK-OK) by vger.kernel.org with ESMTP id S1753762Ab2CCPAf (ORCPT ); Sat, 3 Mar 2012 10:00:35 -0500 Content-Disposition: inline In-Reply-To: <1330772767-16120-4-git-send-email-amit.kachhap@linaro.org> Sender: linux-acpi-owner@vger.kernel.org List-Id: linux-acpi@vger.kernel.org To: Amit Daniel Kachhap Cc: "linux-pm@lists.linux-foundation.org" , "linux-samsung-soc@vger.kernel.org" , "linaro-dev@lists.linaro.org" , "patches@linaro.org" , "linux-kernel@vger.kernel.org" , "lm-sensors@lm-sensors.org" , "eduardo.valentin@ti.com" , "linux-acpi@vger.kernel.org" , "lenb@kernel.org" On Sat, Mar 03, 2012 at 06:06:06AM -0500, Amit Daniel Kachhap wrote: > Export and register information from the tmu temperature sensor to the samsung > exynos kernel thermal framework where different cooling devices and thermal > zone are binded. The exported information is based according to the data > structure thermal_sensor_conf present in exynos_thermal.h. HWMON sysfs > functions are removed as all of them are present in generic linux thermal layer. > > Also the platform data structure is modified to pass frequency cooling > in percentages for each thermal level. > > Signed-off-by: Amit Daniel Kachhap Ah, that is what I meant. I don't think it makes sense to have this as separate patch. Guenter