From mboxrd@z Thu Jan 1 00:00:00 1970 From: Eduardo Valentin Subject: Re: [PATCH 13/13] Thermal: Platform layer changes to provide thermal data Date: Tue, 21 Aug 2012 11:51:37 +0300 Message-ID: <20120821085137.GA2606@besouro> References: <1344516365-7230-1-git-send-email-durgadoss.r@intel.com> <1344516365-7230-14-git-send-email-durgadoss.r@intel.com> <20120821053950.GC9833@besouro> <4D68720C2E767A4AA6A8796D42C8EB591AA82F@BGSMSX101.gar.corp.intel.com> <1345528555.1682.958.camel@rui.sh.intel.com> <4D68720C2E767A4AA6A8796D42C8EB591AA8AD@BGSMSX101.gar.corp.intel.com> <1345531954.1682.965.camel@rui.sh.intel.com> Reply-To: eduardo.valentin@ti.com Mime-Version: 1.0 Content-Type: text/plain; charset=utf-8 Content-Transfer-Encoding: QUOTED-PRINTABLE Return-path: Received: from na3sys009aog116.obsmtp.com ([74.125.149.240]:42605 "EHLO na3sys009aog116.obsmtp.com" rhost-flags-OK-OK-OK-OK) by vger.kernel.org with ESMTP id S1753413Ab2HUIyj (ORCPT ); Tue, 21 Aug 2012 04:54:39 -0400 Received: by obbup19 with SMTP id up19so12299487obb.26 for ; Tue, 21 Aug 2012 01:54:37 -0700 (PDT) Content-Disposition: inline In-Reply-To: <1345531954.1682.965.camel@rui.sh.intel.com> Sender: linux-acpi-owner@vger.kernel.org List-Id: linux-acpi@vger.kernel.org To: Zhang Rui Cc: "R, Durgadoss" , "eduardo.valentin@ti.com" , "lenb@kernel.org" , "rjw@sisk.pl" , "linux-acpi@vger.kernel.org" , "linux-pm@vger.kernel.org" , "amit.kachhap@linaro.org" , "wni@nvidia.com" Hello, On Tue, Aug 21, 2012 at 02:52:34PM +0800, Zhang Rui wrote: > On =E4=BA=8C, 2012-08-21 at 00:41 -0600, R, Durgadoss wrote: > > Hi Rui, > >=20 > > > > > -----Original Message----- > > > > > From: linux-acpi-owner@vger.kernel.org [mailto:linux-acpi- > > > > > owner@vger.kernel.org] On Behalf Of Eduardo Valentin > > > > > Sent: Tuesday, August 21, 2012 11:10 AM > > > > > To: R, Durgadoss > > > > > Cc: lenb@kernel.org; Zhang, Rui; rjw@sisk.pl; linux-acpi@vger= =2Ekernel.org; > > > > > linux-pm@vger.kernel.org; eduardo.valentin@ti.com; > > > > > amit.kachhap@linaro.org; wni@nvidia.com > > > > > Subject: Re: [PATCH 13/13] Thermal: Platform layer changes to= provide > > > > > thermal data > > > > > > > > > > Hello, > > > > > > > > > > On Thu, Aug 09, 2012 at 06:16:05PM +0530, Durgadoss R wrote: > > > > > > This patch shows how can we add platform specific thermal d= ata > > > > > > required by the thermal framework. This is just an example > > > > > > patch, and _not_ for merge. > > > > > > > > > > > > Signed-off-by: Durgadoss R > > > > > > --- > > > > > > arch/x86/platform/mrst/mrst.c | 42 > > > > > +++++++++++++++++++++++++++++++++++++++++ > > > > > > 1 file changed, 42 insertions(+) > > > > > > > > > > > > diff --git a/arch/x86/platform/mrst/mrst.c > > > > > b/arch/x86/platform/mrst/mrst.c > > > > > > index fd41a92..0440db5 100644 > > > > > > --- a/arch/x86/platform/mrst/mrst.c > > > > > > +++ b/arch/x86/platform/mrst/mrst.c > > > > > > @@ -30,6 +30,7 @@ > > > > > > #include > > > > > > #include > > > > > > #include > > > > > > +#include > > > > > > > > > > > > #include > > > > > > #include > > > > > > @@ -78,6 +79,30 @@ struct sfi_rtc_table_entry > > > > > sfi_mrtc_array[SFI_MRTC_MAX]; > > > > > > EXPORT_SYMBOL_GPL(sfi_mrtc_array); > > > > > > int sfi_mrtc_num; > > > > > > > > > > > > +#define MRST_THERMAL_ZONES 3 > > > > > > +struct thermal_zone_params tzp[MRST_THERMAL_ZONES] =3D { > > > > > > + { .thermal_zone_name =3D "CPU", > > > > > > + .throttle_policy =3D THERMAL_FAIR_SHARE, > > > > > > + .num_cdevs =3D 2, > > > > > > + .cdevs_name =3D {"CPU", "Battery"}, > > > > > > + .trip_mask =3D {0x0F, 0x08}, > > > > > > + .weights =3D {80, 20}, }, > > > > > > + > > > > > > + { .thermal_zone_name =3D "Battery", > > > > > > + .throttle_policy =3D THERMAL_FAIR_SHARE, > > > > > > + .num_cdevs =3D 1, > > > > > > + .cdevs_name =3D {"Battery"}, > > > > > > + .trip_mask =3D {0x0F}, > > > > > > + .weights =3D {100}, }, > > > > > > + > > > > > > + { .thermal_zone_name =3D "Skin", > > > > > > + .throttle_policy =3D THERMAL_FAIR_SHARE, > > > > > > + .num_cdevs =3D 2, > > > > > > + .cdevs_name =3D {"Display", "Battery"}, > > > > > > + .trip_mask =3D {0x0F, 0x0F}, > > > > > > + .weights =3D {50, 50}, } > > > > > > > > > > Please consider the comment I sent on your data definition an= d also the > > > > > comment I made on this patch on your RFC series. > > > > > > > > Yes.. I don't know why/how I missed it. > > > > Also, saw the same comment on one of the other patches also. > > > > > > > > Will surely fix this thing in v2. > > > > > > > > BTW, any suggestion for the 'name' of that structure ? :-) > > >=20 > > > hmmm, > > > do we still have thermal_zone_platforms in patch v2? > > > I do not think we need this if we only bind devices via .bind() > > > callback. > >=20 > > We can bind devices via .bind call back, and that will take some lo= ad > > off the framework code. But even then, we would need this structure > > right ? > why? > I'd prefer introduce something like this, > struct thermal_bind_params { > int trip; > unsigned long upper; > unsinged long lower; > int weight; > int sample_period; > } >=20 > and use thermal_zone_bind_cooling_device(tz, cdev, thermal_bind_param= s), > throttle_policy should be set when invoking > thermal_zone_device_register. >=20 > is there any information in thermal_zone_params can not be convert to > thermal_bind_params? IMO, we need to think here carefully. Ideally, we should have a set of = data describing the thermal bindings. This way the code would look simpler a= nd cleaner. If we define a good way to describe the thermal bindings, I don't see w= hy we would need much complexity in the platform driver. Assuming a good data structure design, the task of a platform driver wo= uld then be to fetch the thermal info, either from bootloader, parameters, DT, etc,= then translate that into our binding descriptors, and pushing that data set = forward to the FW. It think the above approach is much cleaner than writing for every plat= form driver a set of function calls with static definitions telling what coo= ling to do for each thermal zone. What do you think? >=20 > thanks, > rui >=20 > > Say, when we obtain platform data from a thermal driver, it > > should know 'what format the platform data is' ..correct ? > >=20 > > I theoretically agree with you that individual platform drivers can > > have data in their own format, but that will be a heavy loss on > > standardization. > >=20 > > So, > > I will remove the extra bind code I added to framework, and > > (keep it the old way it was) but still prefer to have the structure > > put in thermal.h. > >=20 > > Thanks, > > Durga >=20 >=20 -- To unsubscribe from this list: send the line "unsubscribe linux-acpi" i= n the body of a message to majordomo@vger.kernel.org More majordomo info at http://vger.kernel.org/majordomo-info.html