From mboxrd@z Thu Jan  1 00:00:00 1970
From: Hanjun Guo <hanjun.guo@linaro.org>
Subject: Re: [PATCH v9 21/21] ARM64 / ACPI: additions of ACPI documentation
 for arm64
Date: Fri, 27 Feb 2015 22:19:59 +0800
Message-ID: <54F07D0F.7080904@linaro.org>
References: <1424853601-6675-1-git-send-email-hanjun.guo@linaro.org> <1424853601-6675-22-git-send-email-hanjun.guo@linaro.org> <54F05385.2080506@huawei.com>
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To: Shannon Zhao <zhaoshenglong@huawei.com>, Catalin Marinas <catalin.marinas@arm.com>, "Rafael J. Wysocki" <rjw@rjwysocki.net>, Will Deacon <will.deacon@arm.com>, Olof Johansson <olof@lixom.net>, Grant Likely <grant.likely@linaro.org>
Cc: Lorenzo Pieralisi <Lorenzo.Pieralisi@arm.com>, Arnd Bergmann <arnd@arndb.de>, Mark Rutland <mark.rutland@arm.com>, Graeme Gregory <graeme.gregory@linaro.org>, Sudeep Holla <Sudeep.Holla@arm.com>, Jon Masters <jcm@redhat.com>, Marc Zyngier <marc.zyngier@arm.com>, Mark Brown <broonie@kernel.org>, Robert Richter <rric@kernel.org>, Timur Tabi <timur@codeaurora.org>, Ashwin Chaugule <ashwinc@codeaurora.org>, suravee.suthikulpanit@amd.com, linux-acpi@vger.kernel.org, linux-arm-kernel@lists.infradead.org, linux-kernel@vger.kernel.org, linaro-acpi@lists.linaro.org, Al Stone <al.stone@linaro.org>, Yi Li <phoenix.liyi@huawei.com>, Mark Langsdorf <mlangsdo@redhat.com>, "Huangpeng (Peter)" <peter.huangpeng@huawei.com>

Hi Shannon,

On 2015=E5=B9=B402=E6=9C=8827=E6=97=A5 19:22, Shannon Zhao wrote:
> On 2015/2/25 16:40, Hanjun Guo wrote:
>> +Not yet implemented are:
>> +
>> +	-- Section 10: power source and power meter devices
>> +
>> +	-- Section 11: thermal management
>> +
>> +	-- Section 12: embedded controllers interface
>> +
>> +	-- Section 13: SMBus interfaces
>> +
>> +	-- Section 17: NUMA support (prototypes have been submitted for
>> +	   review)
>> +
>>
>
> Here at the end of the file. Redundant blank line.
>
>> +ACPI is also important because hardware and OS vendors have already=
 worked
>> +out how to use it to support the general purpose ecosystem. The inf=
rastructure
>> +is in place, the bindings are in place, and the process is in place=
=2E DT does
>> +exactly what we need it to when working with vertically integrated =
devices,
>> +but we don=E2=80=99t have good processes for supporting what the se=
rver vendors need.
>> +We could potentially get there with DT, but doing so doesn=E2=80=99=
t buy us anything.
>> +ACPI already does what the hardware vendors need, Microsoft won=E2=80=
=99t collaborate
>> +with us on DT, and the hardware vendors would still need to provide=
 two
>> +completely separate firmware interface; one for Linux and one for W=
indows.
>> +
>
> And Here at the end of the file. Redundant blank line.

Thanks a lot for the pointer, I will update it :)

Regards
Hanjun
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