Re: [PATCH v1 10/13] thermal: core: Allow trip pointers to be used for cooling device binding

Rafael J. Wysocki
2023-09-28T10:39:05Z

On Thu, Sep 28, 2023 at 9:10 AM Daniel Lezcano
<daniel.lezcano@linaro.org> wrote:
>
> On 21/09/2023 20:01, Rafael J. Wysocki wrote:
> > From: Rafael J. Wysocki <rafael.j.wysocki@intel.com>
> >
> > Add new helper functions, thermal_bind_cdev_to_trip() and
> > thermal_unbind_cdev_from_trip(), to allow a trip pointer to be used for
> > binding a cooling device to a trip point and unbinding it, respectively,
> > and redefine the existing helpers, thermal_zone_bind_cooling_device()
> > and thermal_zone_unbind_cooling_device(), as wrappers around the new
> > ones, respectively.
> >
> > No intentional functional impact.
> >
> > Signed-off-by: Rafael J. Wysocki <rafael.j.wysocki@intel.com>
> > ---
>
> Reviewed-by: Daniel Lezcano <daniel.lezcano@linaro.org>

Thanks so much for all of the reviews!

I'll now apply the patches for which you have given tags and respin
the rest (governor changes) as a separate series on top of them.