Re: [PATCH v1 10/13] thermal: core: Allow trip pointers to be used for cooling device binding

Daniel Lezcano
2023-09-28T13:31:51Z

On 28/09/2023 12:38, Rafael J. Wysocki wrote:
> On Thu, Sep 28, 2023 at 9:10 AM Daniel Lezcano
> <daniel.lezcano@linaro.org> wrote:
>>
>> On 21/09/2023 20:01, Rafael J. Wysocki wrote:
>>> From: Rafael J. Wysocki <rafael.j.wysocki@intel.com>
>>>
>>> Add new helper functions, thermal_bind_cdev_to_trip() and
>>> thermal_unbind_cdev_from_trip(), to allow a trip pointer to be used for
>>> binding a cooling device to a trip point and unbinding it, respectively,
>>> and redefine the existing helpers, thermal_zone_bind_cooling_device()
>>> and thermal_zone_unbind_cooling_device(), as wrappers around the new
>>> ones, respectively.
>>>
>>> No intentional functional impact.
>>>
>>> Signed-off-by: Rafael J. Wysocki <rafael.j.wysocki@intel.com>
>>> ---
>>
>> Reviewed-by: Daniel Lezcano <daniel.lezcano@linaro.org>
>
> Thanks so much for all of the reviews!

You are welcome. Thanks for cleaning up the ACPI code

> I'll now apply the patches for which you have given tags and respin
> the rest (governor changes) as a separate series on top of them.

Sounds good, thanks

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