messages from 2026-10-18 09:04:55 to 2026-10-19 14:00:34 UTC [more...]
[PATCH AUTOSEL 6.18] soc: amlogic: meson-clk-measure: remove debugfs tree
2026-10-19 13:48 UTC
[PATCH] arm64: dts: amlogic: odroid-go-ultra: use the RK818 RTC as rtc0
2026-10-19 13:04 UTC (3+ messages)
[PATCH v2] irqchip/meson-gpio: Allow the GPIO interrupts to wake the system
2026-10-19 12:58 UTC (2+ messages)
[PATCH 0/3] Add vendor glue layer support and Amlogic A9 implementation
2026-10-19 7:40 UTC (8+ messages)
` [PATCH 1/3] i3c: master: Rework SVC I3C to support vendor glue layers
` [PATCH 2/3] dt-bindings: i3c: Add Amlogic A9 I3C controller
` [PATCH 3/3] i3c: master: svc: Add Amlogic A9 glue layer
[PATCH 0/2] Add initial support for Khadas VIM 5
2026-10-19 7:37 UTC (3+ messages)
` [PATCH 2/2] arm64: dts: amlogic-a9-a311y3-khadas-vim-5: add initial device tree
[PATCH v2 0/3] t7: add some nodes for Amlogc t7
2026-10-19 3:27 UTC (5+ messages)
` [PATCH v2 2/3] dt-bindings: net: meson-dwmac: add T7 support
[PATCH v5 0/7] ASoC: meson: gx: add base support for I2S audio input
2026-10-18 10:39 UTC (9+ messages)
` [PATCH v5 1/7] ASoC: dt-bindings: add amlogic,gxbb-audin
` [PATCH v5 2/7] ASoC: meson: build gx-formatter as a separate module
` [PATCH v5 3/7] ASoC: meson: aiu-encoder-i2s: ensure clk divider gets disabled in hw_free
` [PATCH v5 4/7] ASoC: meson: add AUDIN driver
` [PATCH v5 5/7] ASoC: meson: aiu: add I2S Capture DAI
` [PATCH v5 6/7] ASoC: meson: gx-card: add support for audin FIFO
` [PATCH v5 7/7] arm64: dts: amlogic: gx: add AUDIN node
[PATCH v7 0/4] arm64: amlogic: T7 thermal support
2026-10-18 9:03 UTC (4+ messages)
` [PATCH v7 2/4] arm64: dts: amlogic: t7: Add thermal sensor nodes
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