From mboxrd@z Thu Jan 1 00:00:00 1970 From: dmitry.torokhov@gmail.com (Dmitry Torokhov) Date: Thu, 18 Sep 2014 10:18:12 -0700 Subject: [PATCH v5 2/4] dt-bindings: document Rockchip thermal In-Reply-To: References: <1410926353-15674-1-git-send-email-caesar.wang@rock-chips.com> <1410926353-15674-3-git-send-email-caesar.wang@rock-chips.com> <541ADD58.7070901@rock-chips.com> Message-ID: <20140918171809.GD14809@core.coreip.homeip.net> To: linux-arm-kernel@lists.infradead.org List-Id: linux-arm-kernel.lists.infradead.org On Thu, Sep 18, 2014 at 04:19:26PM +0200, Tomeu Vizoso wrote: > On 18 September 2014 15:25, Caesar Wang wrote: > > Tomeu, > > > > ? 2014?09?18? 17:27, Tomeu Vizoso ??: > >> > >> On 17 September 2014 05:59, Caesar Wang > >> wrote: > >>> > >>> This add the necessary binding documentation for the thermal > >>> found on Rockchip SoCs > >> > >> Hi Caesar, > >> > >> is there any reason to not use the existing thermal bindings? You can > >> find a description in > >> Documentation/devicetree/bindings/thermal/thermal.txt and example code > >> in omap, or in the patches for Tegra recently posted by Mikko > >> Perttunen. > >> > >> Regards, > >> > >> Tomeu > > > > > > Why should I use the existing thermal bindings? > > Because otherwise, you are asking to merge duplicated code. There's a > generic way to define thermal zones, trip points, cooling devices, > etc. And also code to parse and plug them together. Why add > soc-specific code to do the same? > > > I believe omap,tegar and rockchip are the three seperate thermals driver. > > Yes, and OMAP is already using the generic bindings, and the proposed > patches for Tegra as well, and I think it would make sense for > Rockchip to also use them (unless I'm missing something). You are talking about drivers/thermal/of-thermal.c, right? Yes, I think Rockchip should be using the same generic framework if possible. Thanks. -- Dmitry