From mboxrd@z Thu Jan  1 00:00:00 1970
From: viresh.kumar@linaro.org (Viresh Kumar)
Date: Mon, 2 Nov 2015 21:40:07 +0530
Subject: [PATCH v3 0/2] thermal: mediatek: Add cpu power cooling model
In-Reply-To: <9hh4mh4bdoi.fsf@e105922-lin.cambridge.arm.com>
References: <1445515359-8587-1-git-send-email-dawei.chien@mediatek.com>
 <20151028154449.GH3716@ubuntu>
 <9hh4mh4bdoi.fsf@e105922-lin.cambridge.arm.com>
Message-ID: <20151102161007.GI3639@ubuntu>
To: linux-arm-kernel@lists.infradead.org
List-Id: linux-arm-kernel.lists.infradead.org

On 02-11-15, 15:53, Punit Agrawal wrote:
> For dynamic power, I had posted some patches[0][1][2] introducing the
> binding as well as updating cooling device registration via cpufreq
> driver. Now that the SCPI hwmon driver is merged, I should re-send the
> remaining patches.
> 
> [0] http://lkml.iu.edu/hypermail/linux/kernel/1508.0/01020.html
> [1] http://lkml.iu.edu/hypermail/linux/kernel/1508.0/01022.html
> [3] http://lkml.iu.edu/hypermail/linux/kernel/1508.0/01031.html

Sure. Just that whatever can be merged with opp-v2 should be merged.

-- 
viresh