From mboxrd@z Thu Jan 1 00:00:00 1970 From: maxime.ripard@free-electrons.com (Maxime Ripard) Date: Mon, 29 Jan 2018 10:49:18 +0100 Subject: [PATCH v2 11/16] arm: dts: sunxi-h3-h5: add support for the thermal sensor in H3 and H5 In-Reply-To: <20180128232919.12639-12-embed3d@gmail.com> References: <20180128232919.12639-1-embed3d@gmail.com> <20180128232919.12639-12-embed3d@gmail.com> Message-ID: <20180129094918.4fvxpmoftgxxkqg3@flea.lan> To: linux-arm-kernel@lists.infradead.org List-Id: linux-arm-kernel.lists.infradead.org Hi, On Mon, Jan 29, 2018 at 12:29:14AM +0100, Philipp Rossak wrote: > As we have gained the support for the thermal sensor in H3 and H5, > we can now add its device nodes to the device tree. The H3 and H5 share > most of its compatible. The compatible and the thermal sensor cells > will be added in an additional patch per device. > > Signed-off-by: Philipp Rossak > --- > arch/arm/boot/dts/sunxi-h3-h5.dtsi | 9 +++++++++ > 1 file changed, 9 insertions(+) > > diff --git a/arch/arm/boot/dts/sunxi-h3-h5.dtsi b/arch/arm/boot/dts/sunxi-h3-h5.dtsi > index 7a83b15225c7..413c789b588d 100644 > --- a/arch/arm/boot/dts/sunxi-h3-h5.dtsi > +++ b/arch/arm/boot/dts/sunxi-h3-h5.dtsi > @@ -426,6 +426,15 @@ > }; > }; > > + ths: thermal-sensor at 1c25000 { > + reg = <0x01c25000 0x100>; The size is 0x400 Maxime -- Maxime Ripard, Free Electrons Embedded Linux and Kernel engineering http://free-electrons.com -------------- next part -------------- A non-text attachment was scrubbed... Name: signature.asc Type: application/pgp-signature Size: 833 bytes Desc: not available URL: