From mboxrd@z Thu Jan 1 00:00:00 1970 From: maxime.ripard@bootlin.com (Maxime Ripard) Date: Mon, 3 Sep 2018 11:44:04 +0200 Subject: [PATCH v3 20/30] iio: adc: sun4i-gpadc-iio: rework: device specific suspend & resume In-Reply-To: References: <20180830154518.29507-1-embed3d@gmail.com> <20180830154518.29507-21-embed3d@gmail.com> <20180831090915.agbldint76ngj5jf@flea> Message-ID: <20180903094404.ih2fsqsetz6oo7ie@flea> To: linux-arm-kernel@lists.infradead.org List-Id: linux-arm-kernel.lists.infradead.org On Fri, Aug 31, 2018 at 02:05:59PM +0200, Philipp Rossak wrote: > > > On 31.08.2018 11:09, Maxime Ripard wrote: > > > +static int sun4i_ths_suspend(struct sun4i_gpadc_iio *info) > > suspend is already a hook in the kernel, which hasn't the same meaning > > than runtime_suspend (and the same applies to resume), so we'd rather > > pick a better name. And all the functions (and the driver) use gpadc, > > please continue to use that prefix. > > I agree. > For the newer sensors (from H3) the Sensor is referenced in the datasheets > as Thermal Sensor short THS. So I would like to use for the newer sensors > that prefix. Is that ok? Not really. The consistency within the driver is more important. Maxiem -- Maxime Ripard, Bootlin Embedded Linux and Kernel engineering https://bootlin.com -------------- next part -------------- A non-text attachment was scrubbed... Name: signature.asc Type: application/pgp-signature Size: 833 bytes Desc: not available URL: