From: Maxime Ripard <maxime.ripard@bootlin.com>
To: Yangtao Li <tiny.windzz@gmail.com>
Cc: mark.rutland@arm.com, devicetree@vger.kernel.org,
linux-pm@vger.kernel.org, gregkh@linuxfoundation.org,
linus.walleij@linaro.org, daniel.lezcano@linaro.org,
linux-kernel@vger.kernel.org, edubezval@gmail.com, wens@csie.org,
robh+dt@kernel.org, Jonathan.Cameron@huawei.com,
mchehab+samsung@kernel.org, rui.zhang@intel.com,
paulmck@linux.ibm.com, davem@davemloft.net,
linux-arm-kernel@lists.infradead.org
Subject: Re: [PATCH v2 0/2] add thermal driver for h6
Date: Fri, 17 May 2019 09:43:50 +0200 [thread overview]
Message-ID: <20190517074350.m4wtxn5rgiqkjgnz@flea> (raw)
In-Reply-To: <20190516172633.12607-1-tiny.windzz@gmail.com>
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Hi,
On Thu, May 16, 2019 at 01:26:31PM -0400, Yangtao Li wrote:
> This patchset supprt H6 thermal controller.
The discussion is still ongoing on the v1, it would have been better
to wait a bit on it to settle before sending a new version.
Anyway, some comment made there still apply.
Maxime
--
Maxime Ripard, Bootlin
Embedded Linux and Kernel engineering
https://bootlin.com
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prev parent reply other threads:[~2019-05-17 7:44 UTC|newest]
Thread overview: 5+ messages / expand[flat|nested] mbox.gz Atom feed top
2019-05-16 17:26 [PATCH v2 0/2] add thermal driver for h6 Yangtao Li
2019-05-16 17:26 ` [PATCH v2 1/2] thermal: sun8i: " Yangtao Li
2019-05-16 21:35 ` Ondřej Jirman
2019-05-16 17:26 ` [PATCH v2 2/2] dt-bindings: thermal: add binding document for h6 thermal controller Yangtao Li
2019-05-17 7:43 ` Maxime Ripard [this message]
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