From mboxrd@z Thu Jan 1 00:00:00 1970 From: heiko@sntech.de (Heiko Stuebner) Date: Thu, 06 Oct 2016 19:05:26 +0200 Subject: [PATCH 1/3] ARM: dts: rockchip: Enable build of rk3066 MK808 dts In-Reply-To: References: <46121446.zsYkG9qnut@phil> Message-ID: <2552415.D3JWyKI0Mg@phil> To: linux-arm-kernel@lists.infradead.org List-Id: linux-arm-kernel.lists.infradead.org Am Donnerstag, 6. Oktober 2016, 19:05:15 CEST schrieb Pawe? Jarosz: > Hi Heiko > > > This patch breaks bisectability, as it adds a dtb to the makefile that you > > only add in patch3 which makes builds fail. Please fold your patches 1 > > and 3 into one patch and also add and entry to > > Documentation/devicetree/bindings/arm/ rockchip.txt for the board. > > > > > > Heiko > > Should i squash all patches in one? > > I saw now in logs that it's common practise. Nope ... vendor-prefix should stay separate, everything else can be in one patch.