Re: [PATCH] thermal: Remove core header inclusion from drivers

From: Florian Fainelli <f.fainelli@gmail.com>
To: Daniel Lezcano <daniel.lezcano@linaro.org>, rafael.j.wysocki@intel.com
Cc: linux-pm@vger.kernel.org, linux-kernel@vger.kernel.org,
	"Guillaume La Roque" <glaroque@baylibre.com>,
	"Rafael J. Wysocki" <rafael@kernel.org>,
	"Amit Kucheria" <amitk@kernel.org>,
	"Zhang Rui" <rui.zhang@intel.com>,
	"Miquel Raynal" <miquel.raynal@bootlin.com>,
	"Florian Fainelli" <f.fainelli@gmail.com>,
	"Ray Jui" <rjui@broadcom.com>,
	"Scott Branden" <sbranden@broadcom.com>,
	"Broadcom internal kernel review list"
	<bcm-kernel-feedback-list@broadcom.com>,
	"Shawn Guo" <shawnguo@kernel.org>,
	"Sascha Hauer" <s.hauer@pengutronix.de>,
	"Pengutronix Kernel Team" <kernel@pengutronix.de>,
	"Fabio Estevam" <festevam@gmail.com>,
	"NXP Linux Team" <linux-imx@nxp.com>,
	"Andy Gross" <agross@kernel.org>,
	"Bjorn Andersson" <andersson@kernel.org>,
	"Konrad Dybcio" <konrad.dybcio@linaro.org>,
	"Thara Gopinath" <thara.gopinath@gmail.com>,
	"Niklas Söderlund" <niklas.soderlund@ragnatech.se>,
	"Bartlomiej Zolnierkiewicz" <bzolnier@gmail.com>,
	"Krzysztof Kozlowski" <krzysztof.kozlowski@linaro.org>,
	"Alim Akhtar" <alim.akhtar@samsung.com>,
	"Maxime Coquelin" <mcoquelin.stm32@gmail.com>,
	"Alexandre Torgue" <alexandre.torgue@foss.st.com>,
	"Thierry Reding" <thierry.reding@gmail.com>,
	"Jonathan Hunter" <jonathanh@nvidia.com>,
	"Kunihiko Hayashi" <hayashi.kunihiko@socionext.com>,
	"Masami Hiramatsu" <mhiramat@kernel.org>,
	"ye xingchen" <ye.xingchen@zte.com.cn>,
	"Ricardo Neri" <ricardo.neri-calderon@linux.intel.com>,
	"Srinivas Pandruvada" <srinivas.pandruvada@linux.intel.com>,
	"Haowen Bai" <baihaowen@meizu.com>,
	"Minghao Chi" <chi.minghao@zte.com.cn>,
	"open list:THERMAL DRIVER FOR AMLOGIC SOCS"
	<linux-amlogic@lists.infradead.org>,
	"moderated list:BROADCOM BCM2711/BCM2835 ARM ARCHITECTURE"
	<linux-rpi-kernel@lists.infradead.org>,
	"moderated list:BROADCOM BCM2711/BCM2835 ARM ARCHITECTURE"
	<linux-arm-kernel@lists.infradead.org>,
	"open list:ARM/QUALCOMM SUPPORT" <linux-arm-msm@vger.kernel.org>,
	"open list:RENESAS R-CAR THERMAL DRIVERS"
	<linux-renesas-soc@vger.kernel.org>,
	"open list:SAMSUNG THERMAL DRIVER"
	<linux-samsung-soc@vger.kernel.org>,
	"moderated list:ARM/STM32 ARCHITECTURE"
	<linux-stm32@st-md-mailman.stormreply.com>,
	"open list:TEGRA ARCHITECTURE SUPPORT"
	<linux-tegra@vger.kernel.org>
Subject: Re: [PATCH] thermal: Remove core header inclusion from drivers
Date: Mon, 6 Feb 2023 14:35:24 -0800	[thread overview]
Message-ID: <6f276332-54fb-b814-1b64-4e8aa7960eb6@gmail.com> (raw)
In-Reply-To: <20230206153432.1017282-1-daniel.lezcano@linaro.org>

On 2/6/23 07:34, Daniel Lezcano wrote:
> As the name states "thermal_core.h" is the header file for the core
> components of the thermal framework.
> 
> Too many drivers are including it. Hopefully the recent cleanups
> helped to self encapsulate the code a bit more and prevented the
> drivers to need this header.
> 
> Remove this inclusion in every place where it is possible.
> 
> Some other drivers did a confusion with the core header and the one
> exported in linux/thermal.h. They include the former instead of the
> latter. The changes also fix this.
> 
> The tegra/soctherm driver still remains as it uses an internal
> function which need to be replaced.
> 
> The Intel HFI driver uses the netlink internal framework core and
> should be changed to prevent to deal with the internals.
> 
> No functional changes
> 
> [ Applies to thermal/linux-next or linux-pm/linux-next ]
> 
> Signed-off-by: Daniel Lezcano <daniel.lezcano@linaro.org>
> ---

>   drivers/thermal/broadcom/bcm2835_thermal.c  | 1 -

Acked-by: Florian Fainelli <f.fainelli@gmail.com> # bcm2835_thermal.c
-- 
Florian


_______________________________________________
linux-arm-kernel mailing list
linux-arm-kernel@lists.infradead.org
http://lists.infradead.org/mailman/listinfo/linux-arm-kernel