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[66.90.144.107]) by smtp.gmail.com with ESMTPSA id b9-20020a4aba09000000b0044b125e5dabsm4217474oop.35.2022.09.12.08.38.15 (version=TLS1_3 cipher=TLS_AES_256_GCM_SHA384 bits=256/256); Mon, 12 Sep 2022 08:38:16 -0700 (PDT) Received: (nullmailer pid 1345585 invoked by uid 1000); Mon, 12 Sep 2022 15:38:15 -0000 From: Rob Herring To: Bhupesh Sharma Cc: daniel.lezcano@linaro.org, linux-arm-msm@vger.kernel.org, linux-pm@vger.kernel.org, andersson@kernel.org, agross@kernel.org, bhupesh.linux@gmail.com, rafael@kernel.org, devicetree@vger.kernel.org, linux-kernel@vger.kernel.org In-Reply-To: <20220912085049.3517140-4-bhupesh.sharma@linaro.org> References: <20220912085049.3517140-1-bhupesh.sharma@linaro.org> <20220912085049.3517140-4-bhupesh.sharma@linaro.org> Subject: Re: [PATCH 3/4] dt-bindings: thermal: Add qcom,qmi-tmd-device and qcom,tmd-device yaml bindings Date: Mon, 12 Sep 2022 10:38:15 -0500 Message-Id: <1662997095.474707.1345584.nullmailer@robh.at.kernel.org> Precedence: bulk List-ID: X-Mailing-List: linux-arm-msm@vger.kernel.org On Mon, 12 Sep 2022 14:20:48 +0530, Bhupesh Sharma wrote: > Add qcom,qmi-tmd-device and qcom,tmd-device yaml bindings. > > Qualcomm QMI based TMD cooling device(s) are used for various > mitigations for remote subsystem(s) including remote processor > mitigation, rail voltage restriction etc. > > Each child node represents one remote subsystem and each child > of this subsystem in-turn represents separate TMD cooling device. > > Cc: daniel.lezcano@linaro.org > Cc: rafael@kernel.org > Cc: andersson@kernel.org > Cc: robh@kernel.org > Signed-off-by: Bhupesh Sharma > --- > .../bindings/thermal/qcom,qmi-tmd-device.yaml | 78 +++++++++++ > .../bindings/thermal/qcom,tmd-device.yaml | 122 ++++++++++++++++++ > include/dt-bindings/thermal/qcom,tmd.h | 14 ++ > 3 files changed, 214 insertions(+) > create mode 100644 Documentation/devicetree/bindings/thermal/qcom,qmi-tmd-device.yaml > create mode 100644 Documentation/devicetree/bindings/thermal/qcom,tmd-device.yaml > create mode 100644 include/dt-bindings/thermal/qcom,tmd.h > My bot found errors running 'make DT_CHECKER_FLAGS=-m dt_binding_check' on your patch (DT_CHECKER_FLAGS is new in v5.13): yamllint warnings/errors: dtschema/dtc warnings/errors: /builds/robherring/dt-review-ci/linux/Documentation/devicetree/bindings/remoteproc/qcom,adsp.example.dtb: adsp: 'qcom,instance-id' is a required property From schema: /builds/robherring/dt-review-ci/linux/Documentation/devicetree/bindings/thermal/qcom,tmd-device.yaml /builds/robherring/dt-review-ci/linux/Documentation/devicetree/bindings/remoteproc/qcom,adsp.example.dtb: adsp: 'clock-names', 'clocks', 'compatible', 'cx-supply', 'interrupt-names', 'interrupts-extended', 'memory-region', 'qcom,smem-state-names', 'qcom,smem-states', 'smd-edge' do not match any of the regexes: '^tmd-device[0-9]?$', 'pinctrl-[0-9]+' From schema: /builds/robherring/dt-review-ci/linux/Documentation/devicetree/bindings/thermal/qcom,tmd-device.yaml doc reference errors (make refcheckdocs): See https://patchwork.ozlabs.org/patch/ This check can fail if there are any dependencies. The base for a patch series is generally the most recent rc1. If you already ran 'make dt_binding_check' and didn't see the above error(s), then make sure 'yamllint' is installed and dt-schema is up to date: pip3 install dtschema --upgrade Please check and re-submit.