From mboxrd@z Thu Jan 1 00:00:00 1970 Return-Path: X-Spam-Checker-Version: SpamAssassin 3.4.0 (2014-02-07) on aws-us-west-2-korg-lkml-1.web.codeaurora.org Received: from vger.kernel.org (vger.kernel.org [23.128.96.18]) by smtp.lore.kernel.org (Postfix) with ESMTP id D71EEE784B7 for ; Mon, 2 Oct 2023 14:52:54 +0000 (UTC) Received: (majordomo@vger.kernel.org) by vger.kernel.org via listexpand id S237875AbjJBOwy (ORCPT ); Mon, 2 Oct 2023 10:52:54 -0400 Received: from lindbergh.monkeyblade.net ([23.128.96.19]:37832 "EHLO lindbergh.monkeyblade.net" rhost-flags-OK-OK-OK-OK) by vger.kernel.org with ESMTP id S237593AbjJBOwx (ORCPT ); Mon, 2 Oct 2023 10:52:53 -0400 Received: from smtp.kernel.org (relay.kernel.org [52.25.139.140]) by lindbergh.monkeyblade.net (Postfix) with ESMTPS id AC48F9D; Mon, 2 Oct 2023 07:52:50 -0700 (PDT) Received: by smtp.kernel.org (Postfix) with ESMTPSA id 3C14BC433C8; Mon, 2 Oct 2023 14:52:43 +0000 (UTC) DKIM-Signature: v=1; a=rsa-sha256; c=relaxed/simple; d=kernel.org; s=k20201202; t=1696258370; bh=Etqxxf/D+cQv+It0W6UkjfNaCRmxy8NfOCgMspxGg4A=; h=Date:From:To:Cc:Subject:References:In-Reply-To:From; b=MsHyhGPdNFcCYSuzntBAkFqGejwIzlUuGDxKha2iPiGz/eh7uaLHH0+6ZGjddbxtD b/OQPeDqUsB3GGSGwo0Jr/RlK97mCdMXtv+XaKXXlRYTz7HRtXgwOINlmSJL1uzPNC uPOQXNXCufurO8XH4tu3OolpBWCfTbR6Z9DR5kSk7IYosRdvB8yR+oiS2yaqnlA8Si VmDpdUCOvmX1yFW20Z34mcHiVH+7tS0tF2UYophMM38N4LgJKoPmcSfodHkncBnHXL tZ366z+H33h/kxztAeTRHxfpnAzfJ8miO3TNzZQ6687NGwIFR/qAfhkpKtyWiSll3k EK9i13cD9y/PA== Date: Mon, 2 Oct 2023 20:22:39 +0530 From: Manivannan Sadhasivam To: Caleb Connolly Cc: Manivannan Sadhasivam , Andy Gross , Bhupesh Sharma , Bjorn Andersson , Konrad Dybcio , Mathieu Poirier , Rob Herring , Krzysztof Kozlowski , Conor Dooley , "Rafael J. Wysocki" , Daniel Lezcano , Amit Kucheria , Zhang Rui , Sibi Sankar , Thara Gopinath , linux-arm-msm@vger.kernel.org, linux-remoteproc@vger.kernel.org, devicetree@vger.kernel.org, linux-pm@vger.kernel.org Subject: Re: [PATCH 0/4] thermal: Introduce Qualcomm Thermal Mitigation Device support Message-ID: <20231002145239.GA12041@thinkpad> References: <20230905-caleb-qmi_cooling-v1-0-5aa39d4164a7@linaro.org> <20231001155701.GA53767@thinkpad> MIME-Version: 1.0 Content-Type: text/plain; charset=utf-8 Content-Disposition: inline Content-Transfer-Encoding: 8bit In-Reply-To: Precedence: bulk List-ID: X-Mailing-List: linux-arm-msm@vger.kernel.org On Sun, Oct 01, 2023 at 06:26:14PM +0100, Caleb Connolly wrote: > > > On 01/10/2023 16:57, Manivannan Sadhasivam wrote: > > On Fri, Sep 29, 2023 at 05:16:16PM +0100, Caleb Connolly wrote: > > > The Thermal Mitigation Device (TMD) Service is a QMI service that runs > > > on remote subsystems (the modem and DSPs) on Qualcomm SoCs. > > > It exposes various mitigations including passive thermal controls and > > > rail voltage restrictions. > > > > > > This series introduces support for exposing TMDs as cooling devices > > > in the kernel through the thermal framework, using the QMI interface. > > > > > > Each TMD client is described as a child of the remoteproc node in > > > devicetree. With subnodes for each control. > > > > > > > Daniel expressed concerns in the past aganist representing TMD driver as a > > cooling device since it is not tied to thermal zones and the governors cannot > > use it. Instead he suggested to represent it as a powercap device with thermal > > constraints. > > Hi Mani, > > Forgive me as I'm not yet super familiar with the thermal subsystem. > > As I understand it, the DT layout here enables each control to be referenced > under the thermal zones, at least this is the approach taken in CAF 4.9. > > Maybe I don't quite understand what you mean, are you saying that using > thermal zones is the wrong approach? Thermal framework expects each thermal zone represented in DT to have atleast one corresponding thermal sensor defined using "thermal-sensors" property. But with TMD, there is no thermal sensor AFAIK. > > > > So please look into that approach. > > Any recommended reading? Or drivers I can use as a reference? > drivers/powercap/arm_scmi_powercap.c seems to be a good reference. - Mani > Thanks > > > > - Mani > > > > > This series is based on previous work by Bhupesh Sharma which can be > > > found at [1]. I'm sending this as a fresh series as it has been a > > > year since the original version and I have rewritten most of the driver. > > > > > > [1]: https://lore.kernel.org/linux-arm-msm/20220912085049.3517140-1-bhupesh.sharma@linaro.org/ > > > > > > --- > > > Caleb Connolly (4): > > > remoteproc: qcom: probe all child devices > > > dt-bindings: thermal: Add qcom,qmi-cooling yaml bindings > > > thermal: qcom: add qmi-cooling driver > > > MAINTAINERS: Add entry for Qualcomm Cooling Driver > > > > > > .../bindings/remoteproc/qcom,msm8996-mss-pil.yaml | 13 + > > > .../bindings/remoteproc/qcom,pas-common.yaml | 6 + > > > .../bindings/thermal/qcom,qmi-cooling.yaml | 168 +++++++ > > > MAINTAINERS | 8 + > > > drivers/remoteproc/qcom_q6v5.c | 4 + > > > drivers/remoteproc/qcom_q6v5_mss.c | 8 - > > > drivers/thermal/qcom/Kconfig | 13 + > > > drivers/thermal/qcom/Makefile | 1 + > > > drivers/thermal/qcom/qmi-cooling.c | 520 +++++++++++++++++++++ > > > drivers/thermal/qcom/qmi-cooling.h | 428 +++++++++++++++++ > > > 10 files changed, 1161 insertions(+), 8 deletions(-) > > > --- > > > base-commit: 9067f80db58bbce81d5f0703aa2fd261e88bc812 > > > > > > // Caleb (they/them) > > > > > > > -- > // Caleb (they/them) -- மணிவண்ணன் சதாசிவம்