Re: [PATCH 0/3] USB: dwc3: qcom: fix resource leaks on probe deferral

Johan Hovold
2023-11-21T15:03:51Z

On Tue, Nov 21, 2023 at 03:21:34PM +0100, Greg Kroah-Hartman wrote:
> On Mon, Nov 20, 2023 at 05:53:10PM +0100, Johan Hovold wrote:
> > On Mon, Nov 20, 2023 at 09:22:54AM -0600, Andrew Halaney wrote:
> > > On Sat, Nov 18, 2023 at 12:47:30AM +0100, Konrad Dybcio wrote:
> > > > On 17.11.2023 18:36, Johan Hovold wrote:
> > > > > When reviewing the recently submitted series which reworks the dwc3 qcom
> > > > > glue implementation [1], I noticed that the driver's tear down handling
> > > > > is currently broken, something which can lead to memory leaks and
> > > > > potentially use-after-free issues on probe deferral and on driver
> > > > > unbind.
> > > > >
> > > > > Let's get this sorted before reworking driver.
> > > > >
> > > > > Note that the last patch has only been compile tested as I don't have
> > > > > access to a sdm845 device.
> >
> > > > I'll sound like a broken record, but:
> > > >
> > > > is there anyone in the world that is actively benefiting from this failed
> > > > experiment of using the ACPI tables that were shipped with these SoCs?

> > I agree that if we can remove the ACPI hacks in here, we should try do
> > so (e.g. given that no one really uses it anymore).
> >
> > As Andrew already mentioned, that is a separate issue not directly
> > related to this series, though.
> >
> > Removing it before reworking the dwc3 binding [1] and adding multiport
> > support [2] should simplify both of those series quite a bit, however.

> > [1] https://lore.kernel.org/all/20231016-dwc3-refactor-v1-0-ab4a84165470@quicinc.com/
> > [2] https://lore.kernel.org/all/20231007154806.605-1-quic_kriskura@quicinc.com/
> >
>
> So should I apply this series now or not?

Please do. Removing ACPI support should be done later if that's at all
possible.

Johan