Re: [PATCH v2 2/8] dt-bindings: thermal: Add qcom,qmi-cooling yaml bindings

[Gaurav Kohli <gaurav.kohli@oss.qualcomm.com>]

On 2/20/2026 1:14 PM, Krzysztof Kozlowski wrote:
> On 20/02/2026 08:29, Gaurav Kohli wrote:
>>
>>
>> On 2/11/2026 1:43 PM, Krzysztof Kozlowski wrote:
>>> On 11/02/2026 08:37, Gaurav Kohli wrote:
>>>>
>>>>
>>>> On 2/8/2026 3:36 PM, Krzysztof Kozlowski wrote:
>>>>> On 29/01/2026 13:06, Gaurav Kohli wrote:
>>>>>>
>>>>>> On 1/28/2026 4:57 PM, Krzysztof Kozlowski wrote:
>>>>>>> On Tue, Jan 27, 2026 at 09:27:16PM +0530, Gaurav Kohli wrote:
>>>>>>>> The cooling subnode of a remoteproc represents a client of the Thermal
>>>>>>>> Mitigation Device QMI service running on it. Each subnode of the cooling
>>>>>>>> node represents a single control exposed by the service.
>>>>>>>>
>>>>>>>> Signed-off-by: Gaurav Kohli <gaurav.kohli@oss.qualcomm.com>
>>>>>>>> ---
>>>>>>>>      .../bindings/remoteproc/qcom,pas-common.yaml  |  6 ++
>>>>>>>>      .../bindings/thermal/qcom,qmi-cooling.yaml    | 72 +++++++++++++++++++
>>>>>>>>      2 files changed, 78 insertions(+)
>>>>>>>>      create mode 100644 Documentation/devicetree/bindings/thermal/qcom,qmi-cooling.yaml
>>>>>>>>
>>>>>>>> diff --git a/Documentation/devicetree/bindings/remoteproc/qcom,pas-common.yaml b/Documentation/devicetree/bindings/remoteproc/qcom,pas-common.yaml
>>>>>>>> index 68c17bf18987..6a736161d5ae 100644
>>>>>>>> --- a/Documentation/devicetree/bindings/remoteproc/qcom,pas-common.yaml
>>>>>>>> +++ b/Documentation/devicetree/bindings/remoteproc/qcom,pas-common.yaml
>>>>>>>> @@ -80,6 +80,12 @@ properties:
>>>>>>>>            and devices related to the ADSP.
>>>>>>>>          unevaluatedProperties: false
>>>>>>>>      
>>>>>>>> +  cooling:
>>>>>>>> +    $ref: /schemas/thermal/qcom,qmi-cooling.yaml#
>>>>>>>> +    description:
>>>>>>>> +      Cooling subnode which represents the cooling devices exposed by the Modem.
>>>>>>> I do not see the reason why you need 3 (!!!) children here. Everything
>>>>>>> should be folded here.
>>>>>>
>>>>>>
>>>>>> Thanks Krzysztof for review.
>>>>>>
>>>>>> Each subsystem may support multiple thermal mitigation devices through
>>>>>> remote TMD service.
>>>>>>
>>>>>> Because of this multiplicity, introduced separate binding file.
>>>>>
>>>>> This explains nothing. Subsystem does not matter for the binding. My
>>>>> comment stays.
>>>>>
>>>>
>>>> thanks for this suggestion, we will use qcom,pas-common.yaml to define
>>>> bindings and avoid creating new file.
>>>
>>> I asked not to create any children nodes.
>>>
>>
>> We have multiple cores within a subsystem(cdsp) and each core has its
>> own independent DCVS. And also we have dedicated TSENS sensor placed on
>> each core within the subsystem.
> 
> Your own example in this patch had only one device, so how do you
> imagine to convince us with incomplete or half baked code?
> 

Target of this series supports one tmd per remoteproc, due to which we 
have not posted examples of multiple tmd. Can i use dt binding example 
sections to describe all tmd's per remoteproc?

>> As a result, each core requires its own cooling device, which must be
>> linked to its TSENS thermal zone. Because of this, we introduced
>> multiple child nodes—one for each cooling device.
> 
> So you have one device with cooling cells=1+2, no?
> 

This will be a bigger framework change which is not supported, i can see 
other drivers are also using something like this multiple cooling device 
under device node, below are few examples :

->Documentation/devicetree/bindings/hwmon/microchip,emc2305.yaml
   In this multiple fan child nodes are present.

-> Documentation/devicetree/bindings/thermal/nvidia,tegra124-soctherm.yaml
   In this multiple child nodes are present, like heavy and light.

Please suggest if our current approach is fine or you want us to 
implement in some other way.

>>
> Best regards,
> Krzysztof