Re: [PATCH 09/12] dt-bindings: usb: qcom,dwc3: Rename to "glue"

Johan Hovold
2023-11-22T12:25:27Z

On Mon, Oct 16, 2023 at 08:11:17PM -0700, Bjorn Andersson wrote:
> The Qualcomm USB block consists of three intertwined parts, the XHCI,
> the DWC3 core and the Qualcomm DWC3 glue. The exsting binding represents
> the Qualcomm glue part, with the other two represented as in a child
> node.
>
> Rename the qcom,dwc3 binding, to represent that this is indeed only the
> glue part, to make room for a combined binding.
>
> The large "select" is included to avoid the schema to be selected for
> validation with the upcoming flattened binding - which includes
> snps,dwc3 in the compatible.
>
> Signed-off-by: Bjorn Andersson <quic_bjorande@quicinc.com>
> ---

> -title: Qualcomm SuperSpeed DWC3 USB SoC controller
> +title: Qualcomm SuperSpeed DWC3 USB SoC controller glue
> +
> +description:
> + This describes the Qualcomm glue-section of the SuperSpeed DWC3 USB
> + controller found in many Qualcomm platforms, with the XHCI and DWC3 core

This should be "xHCI" throughout the series.

> + portions described as a separate child device.
> + The combined representation, defined by qcom,dwc3.yaml is preferred.

Johan