Re: [PATCH 09/12] dt-bindings: usb: qcom,dwc3: Rename to "glue"

Krzysztof Kozlowski
2023-10-17T06:05:15Z

On 17/10/2023 05:11, Bjorn Andersson wrote:
> The Qualcomm USB block consists of three intertwined parts, the XHCI,
> the DWC3 core and the Qualcomm DWC3 glue. The exsting binding represents
> the Qualcomm glue part, with the other two represented as in a child
> node.
>
> Rename the qcom,dwc3 binding, to represent that this is indeed only the
> glue part, to make room for a combined binding.
>
> The large "select" is included to avoid the schema to be selected for
> validation with the upcoming flattened binding - which includes
> snps,dwc3 in the compatible.
>
> Signed-off-by: Bjorn Andersson <quic_bjorande@quicinc.com>
> ---

Reviewed-by: Krzysztof Kozlowski <krzysztof.kozlowski@linaro.org>

Best regards,
Krzysztof