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[103.229.16.4]) by smtp.gmail.com with ESMTPSA id d2e1a72fcca58-819baa1894csm7620651b3a.10.2026.01.08.03.59.31 (version=TLS1_3 cipher=TLS_AES_128_GCM_SHA256 bits=128/128); Thu, 08 Jan 2026 03:59:35 -0800 (PST) Message-ID: Date: Thu, 8 Jan 2026 19:59:28 +0800 Precedence: bulk X-Mailing-List: linux-arm-msm@vger.kernel.org List-Id: List-Subscribe: List-Unsubscribe: MIME-Version: 1.0 User-Agent: Mozilla Thunderbird Subject: Re: [PATCH v1 1/8] thermal: Add Remote Proc cooling driver To: Gaurav Kohli , andersson@kernel.org, mathieu.poirier@linaro.org, robh@kernel.org, krzk+dt@kernel.org, conor+dt@kernel.org, rafael@kernel.org, daniel.lezcano@linaro.org, rui.zhang@intel.com, lukasz.luba@arm.com, konradybcio@kernel.org, amitk@kernel.org, mani@kernel.org, casey.connolly@linaro.org Cc: linux-arm-msm@vger.kernel.org, devicetree@vger.kernel.org, linux-kernel@vger.kernel.org, linux-pm@vger.kernel.org, Amit Kucheria , zhongqiu.han@oss.qualcomm.com References: <20251223123227.1317244-1-gaurav.kohli@oss.qualcomm.com> <20251223123227.1317244-2-gaurav.kohli@oss.qualcomm.com> Content-Language: en-US From: Zhongqiu Han In-Reply-To: <20251223123227.1317244-2-gaurav.kohli@oss.qualcomm.com> Content-Type: text/plain; charset=UTF-8; format=flowed Content-Transfer-Encoding: 7bit X-Proofpoint-GUID: _UkS_T8-5ZAEQG9juJLxdl_OMEhWMb3t X-Authority-Analysis: v=2.4 cv=APfYzRIR c=1 sm=1 tr=0 ts=695f9c29 cx=c_pps a=mDZGXZTwRPZaeRUbqKGCBw==:117 a=nuhDOHQX5FNHPW3J6Bj6AA==:17 a=IkcTkHD0fZMA:10 a=vUbySO9Y5rIA:10 a=s4-Qcg_JpJYA:10 a=VkNPw1HP01LnGYTKEx00:22 a=EUspDBNiAAAA:8 a=VwQbUJbxAAAA:8 a=7CQSdrXTAAAA:8 a=D6nbwq-aYW_yfCsrQPgA:9 a=QEXdDO2ut3YA:10 a=zc0IvFSfCIW2DFIPzwfm:22 a=a-qgeE7W1pNrGK8U0ZQC:22 X-Proofpoint-Spam-Details-Enc: AW1haW4tMjYwMTA4MDA4MyBTYWx0ZWRfX5KHEENfSvr10 EcvHI0L0KH2ix8ZbQHA9QESqoZFAgZTlmQUrkmLBXzcq17OBzTgavm1DxV6uobWoSM9KBqlzA2o DEHpbS9O93yt5ZcTFrl8lCCHzD0OMKeE5LEJwjcViadtrN1e8HVST/XIHBL9xW2WmLufPcefm9V Kq7nuz6tjrr0YrQJSxg9IKj2weKs1ZUL26pn4+OAKZxvPHMrtNjXAa+V70dqIbby8M/hI1iWTQN ZXkwsQTMKbLh+O+cZQmGIJibA9hzu5+JJ+/UVWhCVrPXoHxLf8BD0kyBu3Ig2Z0N2hMP1A9p9QL a4hP+2h+7PT/4lm5ENuto4YVS2+c14uDQIYscSHvrJow0y5gk2DxUGnUX0x+FJT8cWiCSx3fAVo ecJhprhBIY5Gi6NXQlt5EUFwI6GvoH9UE5UhJxmzhthX1SS5bfdLHfH7w0vMsHtIUeK0PGNIOFY 2RXuabMYEnoaHBX52hQ== X-Proofpoint-ORIG-GUID: _UkS_T8-5ZAEQG9juJLxdl_OMEhWMb3t X-Proofpoint-Virus-Version: vendor=baseguard engine=ICAP:2.0.293,Aquarius:18.0.1121,Hydra:6.1.9,FMLib:17.12.100.49 definitions=2026-01-08_02,2026-01-07_03,2025-10-01_01 X-Proofpoint-Spam-Details: rule=outbound_notspam policy=outbound score=0 malwarescore=0 priorityscore=1501 spamscore=0 lowpriorityscore=0 suspectscore=0 bulkscore=0 clxscore=1015 adultscore=0 phishscore=0 impostorscore=0 classifier=typeunknown authscore=0 authtc= authcc= route=outbound adjust=0 reason=mlx scancount=1 engine=8.22.0-2512120000 definitions=main-2601080083 On 12/23/2025 8:32 PM, Gaurav Kohli wrote: > Add a new generic driver for thermal cooling devices that control > remote processors (modem, DSP, etc.) through various communication > channels. > > This driver provides an abstraction layer between the thermal > subsystem and vendor-specific remote processor communication > mechanisms. > > Suggested-by: Amit Kucheria > Signed-off-by: Gaurav Kohli > --- > MAINTAINERS | 8 ++ > drivers/thermal/Kconfig | 11 ++ > drivers/thermal/Makefile | 2 + > drivers/thermal/remoteproc_cooling.c | 154 +++++++++++++++++++++++++++ > include/linux/remoteproc_cooling.h | 52 +++++++++ > 5 files changed, 227 insertions(+) > create mode 100644 drivers/thermal/remoteproc_cooling.c > create mode 100644 include/linux/remoteproc_cooling.h > > diff --git a/MAINTAINERS b/MAINTAINERS > index 679e5f11e672..c1ba87315cdf 100644 > --- a/MAINTAINERS > +++ b/MAINTAINERS > @@ -25935,6 +25935,14 @@ F: drivers/thermal/cpufreq_cooling.c > F: drivers/thermal/cpuidle_cooling.c > F: include/linux/cpu_cooling.h > > +THERMAL/REMOTEPROC_COOLING > +M: Gaurav Kohli > +L: linux-pm@vger.kernel.org > +S: Supported > +F: drivers/thermal/remoteproc_cooling.c > +F: include/linux/remoteproc_cooling.h > + > + > THERMAL/POWER_ALLOCATOR > M: Lukasz Luba > L: linux-pm@vger.kernel.org > diff --git a/drivers/thermal/Kconfig b/drivers/thermal/Kconfig > index b10080d61860..31e92be34387 100644 > --- a/drivers/thermal/Kconfig > +++ b/drivers/thermal/Kconfig > @@ -229,6 +229,17 @@ config PCIE_THERMAL > > If you want this support, you should say Y here. > > + > +config REMOTEPROC_THERMAL > + bool "Remote processor cooling support" Hi Gaurav, May I know any depends here? > + help > + This implements a generic cooling mechanism for remote processors > + (modem, DSP, etc.) that allows vendor-specific implementations to > + register thermal cooling devices and provide callbacks for thermal > + mitigation. > + > + If you want this support, you should say Y here. > + > config THERMAL_EMULATION > bool "Thermal emulation mode support" > help > diff --git a/drivers/thermal/Makefile b/drivers/thermal/Makefile > index bb21e7ea7fc6..ae747dde54fe 100644 > --- a/drivers/thermal/Makefile > +++ b/drivers/thermal/Makefile > @@ -34,6 +34,8 @@ thermal_sys-$(CONFIG_DEVFREQ_THERMAL) += devfreq_cooling.o > > thermal_sys-$(CONFIG_PCIE_THERMAL) += pcie_cooling.o > > +thermal_sys-$(CONFIG_REMOTEPROC_THERMAL) += remoteproc_cooling.o > + > obj-$(CONFIG_K3_THERMAL) += k3_bandgap.o k3_j72xx_bandgap.o > # platform thermal drivers > obj-y += broadcom/ > diff --git a/drivers/thermal/remoteproc_cooling.c b/drivers/thermal/remoteproc_cooling.c > new file mode 100644 > index 000000000000..a1f948cbde0f > --- /dev/null > +++ b/drivers/thermal/remoteproc_cooling.c > @@ -0,0 +1,154 @@ > +// SPDX-License-Identifier: GPL-2.0 > +/* > + * Remote Processor Cooling Device > + * > + * Copyright (c) 2025, Qualcomm Innovation Center, Inc. All rights reserved. > + */ > + > +#include > +#include > +#include > +#include > +#include > +#include > +#include > + > +#define REMOTEPROC_PREFIX "rproc_" > + > +struct remoteproc_cooling_ops { > + int (*get_max_level)(void *devdata, unsigned long *level); > + int (*get_cur_level)(void *devdata, unsigned long *level); > + int (*set_cur_level)(void *devdata, unsigned long level); > +}; It's better to have a document to explain member? And may I know why double define here(another is in .h file)? should it include .h file remoteproc_cooling.h ? > + > +/** > + * struct remoteproc_cdev - Remote processor cooling device > + * @cdev: Thermal cooling device handle > + * @ops: Vendor-specific operation callbacks > + * @devdata: Private data for vendor implementation > + * @np: Device tree node associated with this cooling device > + * @lock: Mutex to protect cooling device operations > + */ > +struct remoteproc_cdev { > + struct thermal_cooling_device *cdev; > + const struct remoteproc_cooling_ops *ops; > + void *devdata; > + struct device_node *np; > + struct mutex lock; > +}; > + > + > +/* Thermal cooling device callbacks */ > + > +static int remoteproc_get_max_state(struct thermal_cooling_device *cdev, > + unsigned long *state) > +{ > + struct remoteproc_cdev *rproc_cdev = cdev->devdata; > + int ret; > + > + if (!rproc_cdev || !rproc_cdev->ops) > + return -EINVAL; > + > + mutex_lock(&rproc_cdev->lock); > + ret = rproc_cdev->ops->get_max_level(rproc_cdev->devdata, state); > + mutex_unlock(&rproc_cdev->lock); > + > + return ret; > +} > + > +static int remoteproc_get_cur_state(struct thermal_cooling_device *cdev, > + unsigned long *state) > +{ > + struct remoteproc_cdev *rproc_cdev = cdev->devdata; > + int ret; > + > + if (!rproc_cdev || !rproc_cdev->ops) > + return -EINVAL; > + > + mutex_lock(&rproc_cdev->lock); > + ret = rproc_cdev->ops->get_cur_level(rproc_cdev->devdata, state); > + mutex_unlock(&rproc_cdev->lock); > + > + return ret; > +} > + > +static int remoteproc_set_cur_state(struct thermal_cooling_device *cdev, > + unsigned long state) > +{ > + struct remoteproc_cdev *rproc_cdev = cdev->devdata; > + int ret; > + > + if (!rproc_cdev || !rproc_cdev->ops) > + return -EINVAL; > + > + mutex_lock(&rproc_cdev->lock); > + ret = rproc_cdev->ops->set_cur_level(rproc_cdev->devdata, state); > + mutex_unlock(&rproc_cdev->lock); > + > + return ret; > +} > + > +static const struct thermal_cooling_device_ops remoteproc_cooling_ops = { > + .get_max_state = remoteproc_get_max_state, > + .get_cur_state = remoteproc_get_cur_state, > + .set_cur_state = remoteproc_set_cur_state, > +}; > + > +struct remoteproc_cdev * > +remoteproc_cooling_register(struct device_node *np, > + const char *name, const struct remoteproc_cooling_ops *ops, > + void *devdata) > +{ > + struct remoteproc_cdev *rproc_cdev; > + struct thermal_cooling_device *cdev; > + int ret; > + > + if (!name || !ops) { > + return ERR_PTR(-EINVAL); > + } > + May I know which ops callbacks are required and which are optional? If the callback is optional, should we check for null before calling it? > + rproc_cdev = kzalloc(sizeof(*rproc_cdev), GFP_KERNEL); > + if (!rproc_cdev) > + return ERR_PTR(-ENOMEM); > + > + rproc_cdev->ops = ops; > + rproc_cdev->devdata = devdata; > + rproc_cdev->np = np; > + mutex_init(&rproc_cdev->lock); > + > + char *rproc_name __free(kfree) = > + kasprintf(GFP_KERNEL, REMOTEPROC_PREFIX "%s", name); It should have a NULL check when alloc memory. > + /* Register with thermal framework */ > + if (np) { > + cdev = thermal_of_cooling_device_register(np, rproc_name, rproc_cdev, > + &remoteproc_cooling_ops); > + } > + > + if (IS_ERR(cdev)) { > + ret = PTR_ERR(cdev); > + goto free_rproc_cdev; > + } > + > + rproc_cdev->cdev = cdev; > + > + return rproc_cdev; > + > +free_rproc_cdev: > + kfree(rproc_cdev); > + return ERR_PTR(ret); > +} > +EXPORT_SYMBOL_GPL(remoteproc_cooling_register); > + > +void remoteproc_cooling_unregister(struct remoteproc_cdev *rproc_cdev) > +{ > + if (!rproc_cdev) > + return; > + > + thermal_cooling_device_unregister(rproc_cdev->cdev); > + mutex_destroy(&rproc_cdev->lock); > + kfree(rproc_cdev); > +} > +EXPORT_SYMBOL_GPL(remoteproc_cooling_unregister); > + > +MODULE_LICENSE("GPL"); > +MODULE_DESCRIPTION("Remote Processor Cooling Device"); > diff --git a/include/linux/remoteproc_cooling.h b/include/linux/remoteproc_cooling.h > new file mode 100644 > index 000000000000..ef94019d220d > --- /dev/null > +++ b/include/linux/remoteproc_cooling.h > @@ -0,0 +1,52 @@ > +/* SPDX-License-Identifier: GPL-2.0 */ > +/* > + * Remote Processor Cooling Device > + * > + * Copyright (c) 2025, Qualcomm Innovation Center > + */ > + > +#ifndef __REMOTEPROC_COOLING_H__ > +#define __REMOTEPROC_COOLING_H__ > + > +#include > + > +struct device; > +struct device_node; > + > +struct remoteproc_cooling_ops { > + int (*get_max_level)(void *devdata, unsigned long *level); > + int (*get_cur_level)(void *devdata, unsigned long *level); > + int (*set_cur_level)(void *devdata, unsigned long level); > +}; > + > +struct remoteproc_cdev; > + > +#ifdef CONFIG_REMOTEPROC_THERMAL > + > +struct remoteproc_cdev * > +remoteproc_cooling_register(struct device_node *np, > + const char *name, > + const struct remoteproc_cooling_ops *ops, > + void *devdata); > + > +void remoteproc_cooling_unregister(struct remoteproc_cdev *rproc_cdev); > + > +#else /* !CONFIG_REMOTEPROC_THERMAL */ > + > +static inline struct remoteproc_cdev * > +remoteproc_cooling_register(struct device_node *np, > + const char *name, > + const struct remoteproc_cooling_ops *ops, > + void *devdata) > +{ > + return ERR_PTR(-EINVAL); > +} > + > +static inline void > +remoteproc_cooling_unregister(struct remoteproc_cdev *rproc_cdev) > +{ > +} > + > +#endif /* CONFIG_REMOTEPROC_THERMAL */ > + > +#endif /* __REMOTEPROC_COOLING_H__ */ -- Thx and BRs, Zhongqiu Han