From: Caleb Connolly <caleb.connolly@linaro.org>
To: Manivannan Sadhasivam <mani@kernel.org>
Cc: Andy Gross <agross@kernel.org>,
Bhupesh Sharma <bhupesh.linux@gmail.com>,
Bjorn Andersson <andersson@kernel.org>,
Konrad Dybcio <konrad.dybcio@linaro.org>,
Mathieu Poirier <mathieu.poirier@linaro.org>,
Rob Herring <robh+dt@kernel.org>,
Krzysztof Kozlowski <krzysztof.kozlowski+dt@linaro.org>,
Conor Dooley <conor+dt@kernel.org>,
"Rafael J. Wysocki" <rafael@kernel.org>,
Daniel Lezcano <daniel.lezcano@linaro.org>,
Amit Kucheria <amitk@kernel.org>, Zhang Rui <rui.zhang@intel.com>,
Sibi Sankar <quic_sibis@quicinc.com>,
Thara Gopinath <thara.gopinath@gmail.com>,
linux-arm-msm@vger.kernel.org, linux-remoteproc@vger.kernel.org,
devicetree@vger.kernel.org, linux-pm@vger.kernel.org
Subject: Re: [PATCH 0/4] thermal: Introduce Qualcomm Thermal Mitigation Device support
Date: Sun, 1 Oct 2023 18:26:14 +0100 [thread overview]
Message-ID: <cefe711b-d274-4d83-9dda-01f33b342387@linaro.org> (raw)
In-Reply-To: <20231001155701.GA53767@thinkpad>
On 01/10/2023 16:57, Manivannan Sadhasivam wrote:
> On Fri, Sep 29, 2023 at 05:16:16PM +0100, Caleb Connolly wrote:
>> The Thermal Mitigation Device (TMD) Service is a QMI service that runs
>> on remote subsystems (the modem and DSPs) on Qualcomm SoCs.
>> It exposes various mitigations including passive thermal controls and
>> rail voltage restrictions.
>>
>> This series introduces support for exposing TMDs as cooling devices
>> in the kernel through the thermal framework, using the QMI interface.
>>
>> Each TMD client is described as a child of the remoteproc node in
>> devicetree. With subnodes for each control.
>>
>
> Daniel expressed concerns in the past aganist representing TMD driver as a
> cooling device since it is not tied to thermal zones and the governors cannot
> use it. Instead he suggested to represent it as a powercap device with thermal
> constraints.
Hi Mani,
Forgive me as I'm not yet super familiar with the thermal subsystem.
As I understand it, the DT layout here enables each control to be
referenced under the thermal zones, at least this is the approach taken
in CAF 4.9.
Maybe I don't quite understand what you mean, are you saying that using
thermal zones is the wrong approach?
>
> So please look into that approach.
Any recommended reading? Or drivers I can use as a reference?
Thanks
>
> - Mani
>
>> This series is based on previous work by Bhupesh Sharma which can be
>> found at [1]. I'm sending this as a fresh series as it has been a
>> year since the original version and I have rewritten most of the driver.
>>
>> [1]: https://lore.kernel.org/linux-arm-msm/20220912085049.3517140-1-bhupesh.sharma@linaro.org/
>>
>> ---
>> Caleb Connolly (4):
>> remoteproc: qcom: probe all child devices
>> dt-bindings: thermal: Add qcom,qmi-cooling yaml bindings
>> thermal: qcom: add qmi-cooling driver
>> MAINTAINERS: Add entry for Qualcomm Cooling Driver
>>
>> .../bindings/remoteproc/qcom,msm8996-mss-pil.yaml | 13 +
>> .../bindings/remoteproc/qcom,pas-common.yaml | 6 +
>> .../bindings/thermal/qcom,qmi-cooling.yaml | 168 +++++++
>> MAINTAINERS | 8 +
>> drivers/remoteproc/qcom_q6v5.c | 4 +
>> drivers/remoteproc/qcom_q6v5_mss.c | 8 -
>> drivers/thermal/qcom/Kconfig | 13 +
>> drivers/thermal/qcom/Makefile | 1 +
>> drivers/thermal/qcom/qmi-cooling.c | 520 +++++++++++++++++++++
>> drivers/thermal/qcom/qmi-cooling.h | 428 +++++++++++++++++
>> 10 files changed, 1161 insertions(+), 8 deletions(-)
>> ---
>> base-commit: 9067f80db58bbce81d5f0703aa2fd261e88bc812
>>
>> // Caleb (they/them)
>>
>
--
// Caleb (they/them)
next prev parent reply other threads:[~2023-10-01 17:26 UTC|newest]
Thread overview: 24+ messages / expand[flat|nested] mbox.gz Atom feed top
2023-09-29 16:16 [PATCH 0/4] thermal: Introduce Qualcomm Thermal Mitigation Device support Caleb Connolly
2023-09-29 16:16 ` [PATCH 1/4] remoteproc: qcom: probe all child devices Caleb Connolly
2023-09-29 16:16 ` [PATCH 2/4] dt-bindings: thermal: Add qcom,qmi-cooling yaml bindings Caleb Connolly
2023-09-29 17:15 ` Rob Herring
2023-11-07 3:55 ` Bjorn Andersson
2023-09-29 16:16 ` [PATCH 3/4] thermal: qcom: add qmi-cooling driver Caleb Connolly
2023-09-29 16:28 ` Konrad Dybcio
2023-09-29 16:56 ` Caleb Connolly
2023-10-16 21:10 ` Daniel Lezcano
2023-09-29 16:16 ` [PATCH 4/4] MAINTAINERS: Add entry for Qualcomm Cooling Driver Caleb Connolly
2023-09-29 17:17 ` [PATCH 0/4] thermal: Introduce Qualcomm Thermal Mitigation Device support Konrad Dybcio
2023-09-29 18:27 ` Caleb Connolly
2023-10-01 15:57 ` Manivannan Sadhasivam
2023-10-01 17:26 ` Caleb Connolly [this message]
2023-10-02 14:52 ` Manivannan Sadhasivam
2023-10-02 15:00 ` Dmitry Baryshkov
2023-10-02 15:14 ` Caleb Connolly
2023-10-02 15:58 ` Manivannan Sadhasivam
2023-10-02 16:00 ` Dmitry Baryshkov
2023-10-02 16:13 ` Manivannan Sadhasivam
2023-10-02 16:28 ` Neil Armstrong
2023-10-05 2:36 ` Bjorn Andersson
2023-10-10 12:24 ` Manivannan Sadhasivam
2023-10-05 2:52 ` Bjorn Andersson
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