From mboxrd@z Thu Jan 1 00:00:00 1970 Return-Path: Date: Thu, 4 Jun 2015 15:50:33 -0700 From: Stephen Boyd To: Paul Gortmaker Cc: linux-kernel@vger.kernel.org, Emilio =?iso-8859-1?Q?L=F3pez?= , Mike Turquette , Maxime Ripard , linux-clk@vger.kernel.org, linux-arm-kernel@lists.infradead.org Subject: Re: [PATCH] drivers/clk: convert sunxi/clk-mod0.c to use builtin_platform_driver Message-ID: <20150604225033.GD8099@codeaurora.org> References: <1431287385-1526-1-git-send-email-paul.gortmaker@windriver.com> <1433358578-9579-1-git-send-email-paul.gortmaker@windriver.com> MIME-Version: 1.0 Content-Type: text/plain; charset=iso-8859-1 In-Reply-To: <1433358578-9579-1-git-send-email-paul.gortmaker@windriver.com> List-ID: On 06/03, Paul Gortmaker wrote: > This driver builds based on obj-y and hence will not ever be > modular. Change it to use the non-modular registration so that it > won't suffer a compile fail once a header move places the modular > registration within the module.h file. > > Cc: "Emilio López" > Cc: Mike Turquette > Cc: Stephen Boyd > Cc: Maxime Ripard > Cc: linux-clk@vger.kernel.org > Cc: linux-arm-kernel@lists.infradead.org > Signed-off-by: Paul Gortmaker > --- Acked-by: Stephen Boyd -- Qualcomm Innovation Center, Inc. is a member of Code Aurora Forum, a Linux Foundation Collaborative Project