[PATCH v4 0/3] thermal: mediatek: Add cpu power cooling model

[Dawei Chien <dawei.chien-NuS5LvNUpcJWk0Htik3J/w@public.gmane.org>]

Use Intelligent Power Allocation (IPA) technical to add dynamic power model
for binding CPU thermal zone. The power allocator governor allocates power
budget to control CPU temperature.

Power Allocator governor is able to keep SOC temperature within a defined
temperature range to avoid SOC overheat and keep it's performance.
mt8173-cpufreq.c need to register its' own power model with power allocator
thermal governor, so that power allocator governor can allocates suitable
power budget to control CPU temperature.

Binging document is refer to this patchset
https://lkml.org/lkml/2015/11/17/251

Change since V1:
1. Include mt8171.h and sort header file for mt8173.dtsi

Change since V2:
1. Move dynamic/static power model in device tree

Change since V3:
1. Remove static power model.
2. Split V3's device tree in two for thermal zones and dynamic power models respectively.

Dawei Chien (3):
  arm64: dts: mt8173: Add thermal zone node for mt8173 platform.
  arm64: dts: mt8173: Add dynamic power node for mt8173 platform.
  thermal: mediatek: Add cpu dynamic power cooling model.

 arch/arm64/boot/dts/mediatek/mt8173.dtsi |   47 ++++++++++++++++++++++++++++++
 drivers/cpufreq/mt8173-cpufreq.c         |   28 +++++++++++++-----
 2 files changed, 67 insertions(+), 8 deletions(-)

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1.7.9.5
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