From: Leo Yan <leo.yan@linaro.org>
To: Wei Xu <xuwei5@hisilicon.com>, Rob Herring <robh+dt@kernel.org>,
Mark Rutland <mark.rutland@arm.com>,
Michael Turquette <mturquette@baylibre.com>,
Stephen Boyd <sboyd@kernel.org>,
Jassi Brar <jassisinghbrar@gmail.com>,
Arnd Bergmann <arnd@arndb.de>, Olof Johansson <olof@lixom.net>,
Daniel Lezcano <daniel.lezcano@linaro.org>,
linux-arm-kernel@lists.infradead.org, devicetree@vger.kernel.org,
linux-kernel@vger.kernel.org, linux-clk@vger.kernel.org
Cc: Tao Wang <jean.wangtao@linaro.org>, Leo Yan <leo.yan@linaro.org>
Subject: [PATCH v2 4/5] arm64: dts: hi3660: Add thermal cooling management
Date: Tue, 15 May 2018 10:53:14 +0800 [thread overview]
Message-ID: <1526352795-6991-5-git-send-email-leo.yan@linaro.org> (raw)
In-Reply-To: <1526352795-6991-1-git-send-email-leo.yan@linaro.org>
From: Tao Wang <jean.wangtao@linaro.org>
Add nodes and properties for thermal cooling management support.
Signed-off-by: Tao Wang <jean.wangtao@linaro.org>
Signed-off-by: Leo Yan <leo.yan@linaro.org>
---
arch/arm64/boot/dts/hisilicon/hi3660.dtsi | 44 +++++++++++++++++++++++++++++++
1 file changed, 44 insertions(+)
diff --git a/arch/arm64/boot/dts/hisilicon/hi3660.dtsi b/arch/arm64/boot/dts/hisilicon/hi3660.dtsi
index a39da09..e20edd9 100644
--- a/arch/arm64/boot/dts/hisilicon/hi3660.dtsi
+++ b/arch/arm64/boot/dts/hisilicon/hi3660.dtsi
@@ -7,6 +7,7 @@
#include <dt-bindings/interrupt-controller/arm-gic.h>
#include <dt-bindings/clock/hi3660-clock.h>
+#include <dt-bindings/thermal/thermal.h>
/ {
compatible = "hisilicon,hi3660";
@@ -64,6 +65,8 @@
capacity-dmips-mhz = <592>;
clocks = <&stub_clock HI3660_CLK_STUB_CLUSTER0>;
operating-points-v2 = <&cluster0_opp>;
+ #cooling-cells = <2>;
+ dynamic-power-coefficient = <110>;
};
cpu1: cpu@1 {
@@ -112,6 +115,8 @@
capacity-dmips-mhz = <1024>;
clocks = <&stub_clock HI3660_CLK_STUB_CLUSTER1>;
operating-points-v2 = <&cluster1_opp>;
+ #cooling-cells = <2>;
+ dynamic-power-coefficient = <550>;
};
cpu5: cpu@101 {
@@ -1073,5 +1078,44 @@
interrupts = <GIC_SPI 145 IRQ_TYPE_LEVEL_HIGH>;
#thermal-sensor-cells = <1>;
};
+
+ thermal-zones {
+
+ cls0: cls0 {
+ polling-delay = <1000>;
+ polling-delay-passive = <100>;
+ sustainable-power = <4500>;
+
+ /* sensor ID */
+ thermal-sensors = <&tsensor 1>;
+
+ trips {
+ threshold: trip-point@0 {
+ temperature = <65000>;
+ hysteresis = <1000>;
+ type = "passive";
+ };
+
+ target: trip-point@1 {
+ temperature = <75000>;
+ hysteresis = <1000>;
+ type = "passive";
+ };
+ };
+
+ cooling-maps {
+ map0 {
+ trip = <&target>;
+ contribution = <1024>;
+ cooling-device = <&cpu0 THERMAL_NO_LIMIT THERMAL_NO_LIMIT>;
+ };
+ map1 {
+ trip = <&target>;
+ contribution = <512>;
+ cooling-device = <&cpu4 THERMAL_NO_LIMIT THERMAL_NO_LIMIT>;
+ };
+ };
+ };
+ };
};
};
--
1.9.1
next prev parent reply other threads:[~2018-05-15 2:53 UTC|newest]
Thread overview: 9+ messages / expand[flat|nested] mbox.gz Atom feed top
2018-05-15 2:53 [PATCH v2 0/5] Hi3660: enable power management features Leo Yan
2018-05-15 2:53 ` [PATCH v2 1/5] arm64: dts: hi3660: Add mailbox node Leo Yan
2018-05-15 2:53 ` [PATCH v2 2/5] arm64: dts: hi3660: Add stub clock node Leo Yan
2018-05-15 2:53 ` [PATCH v2 3/5] arm64: dts: hi3660: Add CPU frequency scaling support Leo Yan
2018-05-15 2:53 ` Leo Yan [this message]
2018-05-15 2:53 ` [PATCH v2 5/5] hisi: Consolidate the Kconfigs for the CLOCK_STUB and the MAILBOX Leo Yan
2018-05-15 8:23 ` Wei Xu
2018-05-15 14:50 ` [PATCH v2 0/5] Hi3660: enable power management features Wei Xu
2018-05-15 14:54 ` Leo Yan
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