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From:   Bjorn Andersson <andersson@kernel.org>
To:     krzysztof.kozlowski@linaro.org,
        Konrad Dybcio <konrad.dybcio@linaro.org>, agross@kernel.org,
        linux-arm-msm@vger.kernel.org
Cc:     quic_sibis@quicinc.com, Rob Herring <robh+dt@kernel.org>,
        devicetree@vger.kernel.org, linux-pm@vger.kernel.org,
        djakov@kernel.org, linux-kernel@vger.kernel.org,
        marijn.suijten@somainline.org,
        Krzysztof Kozlowski <krzysztof.kozlowski+dt@linaro.org>
Subject: Re: (subset) [PATCH v2 1/3] dt-bindings: interconnect: OSM L3: Add SM6350 OSM L3 compatible
Date:   Wed, 18 Jan 2023 17:55:35 -0600
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On Wed, 4 Jan 2023 18:16:40 +0100, Konrad Dybcio wrote:
> SM6350, similarly to SDM845, uses OSM hardware for L3 scaling.
> Document it.
> 
> 

Applied, thanks!

[2/3] arm64: dts: qcom: sm6350: Add OSM L3 node
      commit: e17a806571bb01bb951faeec645944850241eae3
[3/3] arm64: dts: qcom: sm6350: Set up DDR & L3 scaling
      commit: bba952275b81971d329189a879a5611bc8eb0dd1

Best regards,
-- 
Bjorn Andersson <andersson@kernel.org>