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From: Bjorn Andersson <andersson@kernel.org>
To: Andy Gross <agross@kernel.org>,
	Konrad Dybcio <konrad.dybcio@linaro.org>,
	Jonathan Cameron <jic23@kernel.org>,
	Lars-Peter Clausen <lars@metafoo.de>,
	Rob Herring <robh+dt@kernel.org>,
	Krzysztof Kozlowski <krzysztof.kozlowski+dt@linaro.org>,
	Conor Dooley <conor+dt@kernel.org>,
	Luca Weiss <luca.weiss@fairphone.com>
Cc: ~postmarketos/upstreaming@lists.sr.ht,
	phone-devel@vger.kernel.org,
	linux-kernel@vger.kernel.org,
	linux-arm-msm@vger.kernel.org,
	linux-iio@vger.kernel.org,
	devicetree@vger.kernel.org
Subject: Re: [PATCH 0/4] Add Fairphone 5 thermals (PMK7325, PM7250B, PM7325)
Date: Sat,  2 Dec 2023 20:54:38 -0800
Message-ID: <170157925809.1717511.3113832457495825027.b4-ty@kernel.org>
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In-Reply-To: <20231013-fp5-thermals-v1-0-f14df01922e6@fairphone.com>
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On Fri, 13 Oct 2023 10:09:52 +0200, Luca Weiss wrote:
> Configure the necessary components to register some thermal zones in
> Linux for the different thermistors found on the Fairphone 5.
> 
> The names for the thermal zones and ADCs were taken from the downstream
> kernel but double checked against hardware schematics.
> 
> 
> [...]

Applied, thanks!

[1/4] iio: adc: Add PM7325 PMIC7 ADC bindings
      commit: 18c74d56fe6070c7c38058d7b43ccf2102abebcd
[2/4] arm64: dts: qcom: qcm6490-fairphone-fp5: Add PM7250B thermals
      commit: 4c343fe9b68adeca1aa3a851bd06e62ecdaed180
[3/4] arm64: dts: qcom: qcm6490-fairphone-fp5: Add PMK7325 thermals
      commit: 46a2f77e1eb81990d303a94ab62f1bf79d0c9926
[4/4] arm64: dts: qcom: qcm6490-fairphone-fp5: Add PM7325 thermals
      commit: ae1122c375707a36c8fecebba745421a1e0ff93f

Best regards,
-- 
Bjorn Andersson <andersson@kernel.org>