Re: [PATCH v3 2/2] dt-bindings: mfd: Add properties for thermal sensor cells

[Krzysztof Kozlowski <krzk@kernel.org>]

On 25/11/2024 09:52, Krzysztof Kozlowski wrote:
> On 13/11/2024 04:05, Guenter Roeck wrote:
>> On 11/12/24 18:39, Sung-Chi, Li wrote:
>>> The cros_ec supports reading thermal values from thermal sensors
>>> connect to it. Add the property '#thermal-sensor-cells' bindings, such
>>> that thermal framework can recognize cros_ec as a valid thermal device.
>>>
>>> Signed-off-by: Sung-Chi, Li <lschyi@chromium.org>
>>> Acked-by: Conor Dooley <conor.dooley@microchip.com>
>>> ---
>>>   Changes in v2:
>>>     - Add changes for DTS binding.
>>>   Changes in v3:
>>>     - Remove unneeded Change-Id tag in commit message.
>>> ---
>>
>> I can't apply this one (not in hwmon space), so
>>
>> Acked-by: Guenter Roeck <linux@roeck-us.net>
>>
>> with the assumption that Lee will pick it up.
> 
> This was merged, while I was AFK, so the ship has sailed, but let me
> state here objection for any future discussions:
> 
> NAK, this is not a thermal sensor. The commit msg explains what they
> want to achieve, but that's not a valid reason to add property from
> different class of devices.
> 
> This is some hardware/temperature monitoring device or power supply, not
> part of SoC, not integrated into any SoC thermal zone. Calling it
> thermal sensor is huge stretch and inappropriate hardware description
> leading to next patches like calling it a SoC cooling device, instead of
> simple power supply (for which we have bindings!).
Ah, wait, this was not merged, so I can actually NAK it.

BTW, all your patches are incorrectly ordered - bindings are always
before the users. You cannot merge user of a binding without or before
the binding.

Best regards,
Krzysztof