From: Felipe Balbi <balbi@ti.com>
To: "Ivan T. Ivanov" <iivanov@mm-sol.com>
Cc: balbi@ti.com, rob.herring@calxeda.com, pawel.moll@arm.com,
mark.rutland@arm.com, swarren@wwwdotorg.org,
ian.campbell@citrix.com, rob@landley.net,
gregkh@linuxfoundation.org, grant.likely@linaro.org,
idos@codeaurora.org, mgautam@codeaurora.org,
devicetree@vger.kernel.org, linux-doc@vger.kernel.org,
linux-kernel@vger.kernel.org, linux-usb@vger.kernel.org,
linux-omap@vger.kernel.org, linux-arm-msm@vger.kernel.org
Subject: Re: [RFC PATCH v2 3/3] usb: dwc3: Add Qualcomm DWC3 glue layer driver
Date: Fri, 9 Aug 2013 16:32:13 +0300 [thread overview]
Message-ID: <20130809133213.GJ12041@radagast> (raw)
In-Reply-To: <1376042027-9798-4-git-send-email-iivanov@mm-sol.com>
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On Fri, Aug 09, 2013 at 12:53:47PM +0300, Ivan T. Ivanov wrote:
> From: "Ivan T. Ivanov" <iivanov@mm-sol.com>
>
> DWC3 glue layer is hardware layer around Synopsys DesignWare
> USB3 core. Its purpose is to supply Synopsys IP with required
> clocks, voltages and interface it with the rest of the SoC.
>
> Signed-off-by: Ivan T. Ivanov <iivanov@mm-sol.com>
same comments from previous version.
--
balbi
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next prev parent reply other threads:[~2013-08-09 13:32 UTC|newest]
Thread overview: 12+ messages / expand[flat|nested] mbox.gz Atom feed top
2013-08-09 9:53 [RFC PATCH v2 0/3] DWC3 USB support for Qualcomm platform Ivan T. Ivanov
2013-08-09 9:53 ` [RFC PATCH v2 1/3] usb: dwc3: msm: Add device tree binding information Ivan T. Ivanov
[not found] ` <169628C9-00BA-4E58-BF65-7B180E6BE4ED@codeaurora.org>
2013-08-12 18:04 ` Felipe Balbi
2013-08-12 18:49 ` Kumar Gala
2013-08-13 7:32 ` Ivan T. Ivanov
2013-08-13 7:21 ` Ivan T. Ivanov
2013-08-13 19:57 ` Stephen Warren
2013-08-14 7:18 ` Ivan T. Ivanov
2013-08-09 9:53 ` [RFC PATCH v2 2/3] usb: phy: Add Qualcomm SS-USB and HS-USB drivers for DWC3 core Ivan T. Ivanov
2013-08-09 9:53 ` [RFC PATCH v2 3/3] usb: dwc3: Add Qualcomm DWC3 glue layer driver Ivan T. Ivanov
2013-08-09 13:32 ` Felipe Balbi [this message]
2013-08-09 15:16 ` Ivan T. Ivanov
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