Re: [PATCH] mtd: gpmi: Remove "We support only one NAND chip" from bindings doc

[Huang Shijie <shijie8-Re5JQEeQqe8AvxtiuMwx3w@public.gmane.org>]

On Sat, Nov 29, 2014 at 10:53:26PM -0800, Brian Norris wrote:
> On Sat, Nov 29, 2014 at 10:40:50AM +0800, Huang Shijie wrote:
> > On Fri, Nov 28, 2014 at 08:01:41AM +0100, Stefan Roese wrote:
> > > On 28.11.2014 02:48, Huang Shijie wrote:
> > > >On Thu, Nov 27, 2014 at 03:18:49PM +0100, Stefan Roese wrote:
> > > >>This sentence "We support only one NAND chip now" is not true any more.
> > > >>Multiple chips are supported. So lets remove this sentence to not
> > > >
> > > >The gpmi can only supports one chip. Of course, there are maybe two dies
> > > >in this single chip.
> > > 
> > > Now I'm a bit confused. The i.MX6 supports 4 chips select signals. And isn't
> > > "two dies in this single chip" not practically the same as connecting 2 (or
> > > more) chips (same device) to multiple chip selects of the SoC? Where is the
> > > difference here?
> > The "one chip" here is means the "one package" (TSOP or BGA ....).
> 
> Then why is this even in the DT binding doc? Isn't that a board-level
> constraint (and not a chip property) which should be obvious to the
> user? If so, then should we just drop the language? Or at a minimum,
> make it more specific so it doesn't confuse readers.

yes. It is okay to send a patch to make it more clear.

> 
> > (In logic, "two dies in this single chip" is same as connecting 2 chips
> > to the gpmi.)
> 
> ...which means that logically, you can connect more than one chip to the
> GPMI, right?
The gpmi can only connect with one physical chip now, but there maybe
two DIEs in this chip.

thanks
Huang Shijie
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